Head Line: SAMSUNG ELECTRONICS CO., LTD. granted US Patent for "Semiconductor package"

Press/Media: Press / Media

Period2023 Jan 26

Media coverage

1

Media coverage

  • TitleHead Line: SAMSUNG ELECTRONICS CO., LTD. granted US Patent for "Semiconductor package"
    Media name/outletImpact Financial News
    Country/TerritoryUnited Kingdom
    Date23/1/26
    PersonsChulwoo Kim
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