New Engineering Research from University of Tokyo Described (Stress-Engineered SLIM-Cut of Ultra-Thin Silicon Using Saccharin-Modified Electroplated Ni Films)

Press/Media: Press / Media

Period2026 Feb 3

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1

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  • TitleNew Engineering Research from University of Tokyo Described (Stress-Engineered SLIM-Cut of Ultra-Thin Silicon Using Saccharin-Modified Electroplated Ni Films)
    Media name/outletEngineering Daily News
    Country/TerritoryUnited States
    Date26/2/3
    PersonsJoonho Lee
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