Researchers from Inha University Publish Findings in Engineering (Dual Strategy of Electroless Metal Deposition and Surface Silylation Toward Scalable Low-Temperature Hybrid Bonding for Advanced Packaging Applications)

Press/Media: Press / Media

Period2025 Jul 24

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1

Media coverage

  • TitleResearchers from Inha University Publish Findings in Engineering (Dual Strategy of Electroless Metal Deposition and Surface Silylation Toward Scalable Low-Temperature Hybrid Bonding for Advanced Packaging Applications)
    Media name/outletElectronics Daily
    Country/TerritoryUnited States
    Date25/7/24
    PersonsChulwoo Kim
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