US Patent Issued to Korea University Research and Business Foundation, Sejong Campus on April 25 for "Linker composition comprising silica-forming peptides" (South Korean Inventors)

Press/Media: Press / Media

Period	2023 Apr 26

Media coverage

Title	US Patent Issued to Korea University Research and Business Foundation, Sejong Campus on April 25 for "Linker composition comprising silica-forming peptides" (South Korean Inventors)
Media name/outlet	US Fed News
Country/Territory	United States
Date	23/4/26
URL	metabase.moreover.com/noarticleurl?type=psh&lni=683G-GS91-JDKC-R3DW-00000-00
Persons	SeungPil Pack