US Patent Issued to SAMSUNG ELECTRONICS on April 11 for "Semiconductor device and method for fabricating the same" (South Korean Inventors)

Press/Media: Press / Media

Period	2023 May 1

Media coverage

Title	US Patent Issued to SAMSUNG ELECTRONICS on April 11 for "Semiconductor device and method for fabricating the same" (South Korean Inventors)
Media name/outlet	US Fed News
Country/Territory	United States
Date	23/5/1
URL	metabase.moreover.com/noarticleurl?type=psh&lni=684M-0JW1-JDKC-R4K0-00000-00
Persons	Seon Wook Kim