US Patent Issued to SAMSUNG ELECTRONICS on Feb. 1 for "Semiconductor devices, methods of designing layouts of semiconductor devices and methods of fabricating semiconductor devices" (South Korean Inventors)

Press/Media: Press / Media

Period2022 Feb 3

Media coverage

1

Media coverage

  • TitleUS Patent Issued to SAMSUNG ELECTRONICS on Feb. 1 for "Semiconductor devices, methods of designing layouts of semiconductor devices and methods of fabricating semiconductor devices" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date22/2/3
    PersonsSeong Whan Lee
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