US Patent Issued to SAMSUNG ELECTRONICS on Jan. 24 for "Semiconductor package" (South Korean Inventors)

Press/Media: Press / Media

Period2023 Jan 25

Media coverage

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Media coverage

  • TitleUS Patent Issued to SAMSUNG ELECTRONICS on Jan. 24 for "Semiconductor package" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date23/1/25
    PersonsChulwoo Kim
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