US Patent Issued to SAMSUNG ELECTRONICS on Jan. 30 for "Semiconductor package including test pad" (South Korean Inventors)

Press/Media: Press / Media

Period2024 Jan 31

Media coverage

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  • TitleUS Patent Issued to SAMSUNG ELECTRONICS on Jan. 30 for "Semiconductor package including test pad" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date24/1/31
    PersonsJae Hoon Lee
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