US Patent Issued to SAMSUNG ELECTRONICS on March 7 for "Defect detection structure of a semiconductor die, semiconductor device including the same and method of detecting defects in semiconductor die" (South Korean Inventors)

Press/Media: Press / Media

Period2023 Mar 8

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  • TitleUS Patent Issued to SAMSUNG ELECTRONICS on March 7 for "Defect detection structure of a semiconductor die, semiconductor device including the same and method of detecting defects in semiconductor die" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date23/3/8
    PersonsJae Hoon Lee
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