US Patent Issued to SAMSUNG ELECTRONICS on Oct. 11 for "Semiconductor devices with layers commonly contacting fins and methods of manufacturing the same" (South Korean Inventors)

Press/Media: Press / Media

Period	2022 Oct 12

Media coverage

Title	US Patent Issued to SAMSUNG ELECTRONICS on Oct. 11 for "Semiconductor devices with layers commonly contacting fins and methods of manufacturing the same" (South Korean Inventors)
Media name/outlet	US Fed News
Country/Territory	United States
Date	22/10/12
URL	metabase.moreover.com/noarticleurl?type=psh&lni=66KR-M0W1-JDKC-R10T-00000-00
Persons	Sung Woo Jung