US Patent Issued to SAMSUNG ELECTRONICS on Oct. 12 for "Semiconductor package including a substrate having two silicon layers formed on each other" (South Korean Inventors)

Press/Media: Press / Media

Period2021 Oct 12

Media coverage

1

Media coverage

  • TitleUS Patent Issued to SAMSUNG ELECTRONICS on Oct. 12 for "Semiconductor package including a substrate having two silicon layers formed on each other" (South Korean Inventors)
    Media name/outletUS Fed News
    Country/TerritoryUnited States
    Date21/10/12
    PersonsChulwoo Kim
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