Calculated based on number of publications stored in Pure and citations from Scopus
1996 …2023

Research activity per year

If you made any changes in Pure these will be visible here soon.

Network

Junyoung Song

  • Department of Electrical Engineering
  • Electrical and Electronics Engineering Department
  • Korea University
  • Intel
  • Optoelectronics Lab.
  • Advanced Integrated Systems Lab.
  • Department of Electronic Engineering
  • Dept. Mechanical Eng.
  • Department of Nano-Semiconductor
  • Dept. of Mechanical Eng.
  • School of Electrical Eng.
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electronics and Electrical Engineering, Korea University
  • Dept. of Mechanical Engineering, Korea Univ.
  • Incheon National University
  • Department of Electrical Engineering
  • Computer Network Lab.
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Department of Mechanical Engineering, Korea University, Anam-Dong, Sungbuk-Gu, Seoul 136-713

External person

Sewook Hwang

  • Department of Electrical Engineering
  • Electrical and Electronics Engineering Department
  • Computer Network Lab.
  • Korea University
  • Department of Electronic Engineering
  • Department of Nano-Semiconductor
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electronics and Electrical Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Electrical and Computer Engineering, Korea University
  • SK Hynix Inc.
  • Butterfly Network Inc.
  • Butterfly Network
  • SK Corporation

External person

Inhwa Jung

  • Department of Electrical Engineering
  • Korea University
  • Department of Electronic Engineering
  • Advanced Integrated Systems Lab.
  • Optoelectronics Lab.
  • Electrical and Electronics Engineering Department
  • Computer Network Lab.
  • Robotics Laboratory
  • Faculty of Electronics and Electrical Eng.
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electronics and Electrical Engineering, Korea University
  • School of Electrical Engineering, Korea University
  • Nanoelectronics Laboratory
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Department of Electrical Engineering
  • Electrical and Computer Engineering, Korea University
  • School of Electrical, Engineering Korea University
  • SK Hynix Inc.
  • SK Corporation

External person

Hyunsu Park

  • Korea University
  • Department of Electronic Engineering
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • SK Corporation

External person

Yoon Jae Choi

  • Korea University
  • Department of Electronic Engineering
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University

External person

Jungmoon Kim

  • Korea Institute of Science and Technology
  • Korea University
  • Hong Kong University of Science and Technology
  • School of Electrical Eng.
  • Optoelectronics Lab.
  • Dept. of Electronic and Computer Engineering
  • Department of Electronic Engineering
  • Center for Bionics, Biomedical Research Institute, Korea Institute of Science and Technology
  • Robotics Laboratory
  • Computer Network Lab.
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • School of Electrical Engineering, Korea University
  • Nanoelectronics Laboratory
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • School of Electrical, Engineering Korea University

External person

Jincheol Sim

  • Korea University

External person

Jonghyuck Choi

  • Korea University

External person

Sung Mo Kang

  • KAIST
  • University of California at Santa Cruz
  • University of California, Merced
  • Baskin School of Engineering, University of California at Santa Cruz
  • Univ of Illinois at Urbana-Champaign
  • Univ. of California
  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • Univ. of California, Santa Cruz
  • Dept. of Elec. and Comp. Engineering
  • IBM Microelectronics Division
  • Korea Advanced Institute of Science and Technology
  • IBM
  • University of California Merced
  • Baskin School of Engineering
  • Univ. Illinois at Urbana-Champaign
  • IEEE
  • Coordinated Science Laboratory
  • College of Information Science and Technology
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • School of Natural Science
  • Dept. of Electrical and Comp. Eng.
  • Global Foundries, Inc.

External person

Minseob Shim

  • Korea University
  • University of Michigan, Ann Arbor
  • Department of Electronic Engineering
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Department of Electrical Engineering
  • Korea Electrotechnology Research Institute
  • Korea Electronics Technology Institute

External person

Moo Young Kim

  • Electrical and Electronics Engineering Department
  • Korea University
  • Advanced Integrated Systems Lab.
  • Electrical and Computer Engineering, Korea University

External person

Young Ho Kwak

  • Korea University
  • Computer Network Lab.
  • Electrical and Computer Engineering, Korea University
  • Department of Electrical Engineering
  • Silicon Image
  • Seoul National University

External person

Hyun Woo Lee

  • Department of Nano-Semiconductor
  • SK Hynix Inc.
  • Korea University
  • SK Corporation

External person

Inho Park

  • Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Department of Electrical Engineering

External person

Junwon Jeong

  • Korea University
  • University of Michigan, Ann Arbor
  • Department of Electronic Engineering
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Department of Electrical Engineering
  • Korea Electrotechnology Research Institute
  • Korea Electronics Technology Institute
  • Sookmyung Women's University

External person

Yeonho Lee

  • Korea University
  • Department of Electronic Engineering
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Department of Nano-Semiconductor
  • Samsung
  • SK Hynix Inc.
  • SK Corporation

External person

Youngwook Kwon

  • Korea University

External person

Junyoung Maeng

  • Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Department of Electrical Engineering

External person

Minyoung Song

  • Korea University
  • Imec-Netherlands

External person

Young Jung Choi

  • SK Hynix Inc
  • Hynix Semiconductor
  • Graphics Memory Design Team
  • SK Hynix Inc.
  • SK Corporation

External person

Hokyu Lee

  • Electrical Engineering, Korea University
  • Korea University
  • Dept. of Elect. Eng.
  • Advanced Integrated Systems Lab.
  • Compiler and Microarchitecture Laboratory, School of Electrical and Computer Engineering, Korea University
  • Computer Network Lab.
  • Electrical and Electronics Engineering Department
  • Department of Electronic Engineering
  • Department of Electronics and Electrical Engineering, Korea University
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Electrical and Computer Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University

External person

Sang Geun Bae

  • Korea University
  • Department of Electronic Engineering
  • Electrical and Electronics Engineering Department
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electronics and Electrical Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • SK Hynix Inc.
  • Butterfly Network Inc.
  • SK Corporation

External person

Dongsuk Shin

  • Hynix Semiconductor
  • Hynix Semiconductor, Icheon
  • SK Hynix Inc
  • Graphics Memory Design Team
  • Korea University
  • Electrical and Electronics Engineering Department
  • Computer Network Lab.
  • Advanced Integrated Systems Lab.
  • Electrical and Computer Engineering, Korea University
  • SK Hynix Inc.
  • SK Corporation

External person

Phi Hung Pham

  • Korea University
  • School of Electrical Eng.
  • Electrical and Electronics Engineering Department

External person

Byong Tae Chung

  • SK Hynix Inc
  • SK Corporation
  • SK Hynix Inc.

External person

Jae Hun Jun

  • LG Corporation
  • Korea University
  • Circuit Research Division
  • Department of Electronic Engineering
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Electrical and Electronics Engineering Department

External person

Hyunjin Kim

  • Korea University

External person

Jabeom Koo

  • Korea University
  • SK Hynix Inc.
  • SK Corporation

External person

Seungwoo Park

  • Korea University

External person

Jaegeun Song

  • Korea University

External person

Yunsoo Park

  • Korea University
  • Robotics Laboratory
  • School of Electrical Engineering, Korea University
  • Nanoelectronics Laboratory
  • School of Electrical, Engineering Korea University
  • Department of Electrical Engineering

External person

Kwan Weon Kim

  • SK Hynix Inc
  • SK Hynix Inc.
  • SK Corporation

External person

David Blaauw

  • University of Michigan, Ann Arbor

External person

Dennis Sylvester

  • University of Michigan, Ann Arbor

External person

Hyunsoo Chae

  • Electronics
  • Korea University
  • Electrical and Electronics Engineering Department
  • Computer Network Lab.
  • Electrical and Computer Engineering, Korea University

External person

Janghoon Song

  • Samsung
  • Korea University
  • Computer Network Lab.
  • Faculty of Electronics and Electrical Eng.
  • Electrical and Computer Engineering, Korea University

External person

Young J. Min

  • Korea University
  • Samsung
  • Electrical and Electronics Engineering Department
  • Department of Electronic Engineering
  • School of Electrical Eng.
  • Memory Division
  • Optoelectronics Lab.
  • Computer Network Lab.
  • Faculty of Electronics and Electrical Eng.
  • Robotics Laboratory
  • Department of Electronics and Electrical Engineering, Korea University
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Memory Division, Samsung Electronics
  • School of Electrical and Engineering, Korea University
  • School of Electrical Engineering, Korea University
  • Nanoelectronics Laboratory
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Department of Electrical Engineering
  • Electrical and Computer Engineering, Korea University
  • Compiler and Microarchitecture Laboratory
  • School of Electrical, Engineering Korea University

External person

Seokhyeon Jeong

  • University of Michigan, Ann Arbor

External person

Yohan Choi

  • Korea University

External person

Yongtae Kim

  • Korea University
  • Advanced Integrated Systems Lab.
  • Department of Electronic Engineering
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Kyungpook National University

External person

Kwang Hyun Baek

  • Chung-Ang University
  • School of Electrical and Electronics Engineering, Chung-Ang University
  • School of Electrical and Electronics Engineering
  • University of Illinois at Urbana-Champaign
  • Teledyne Scientific and Imaging
  • Coordinated Science Laboratory
  • Rockwell Collins
  • Teledyne Technologies
  • Rockwell International Science Center

External person

Chaegang Lim

  • Electrical Engineering, Korea University
  • Korea University

External person

Jinwoo Jeon

  • Korea University

External person

Sunghoon Ahn

  • Hynix Semiconductor, Inc.
  • Hynix Semiconductor, Inc
  • SK Hynix Inc
  • Korea University
  • Department of Electronic Engineering
  • Optoelectronics Lab.
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Department of Electrical Engineering
  • SK Hynix Inc.
  • SK Corporation

External person

Gil S. Kim

  • Korea Univ.
  • Korea University
  • Korea University
  • Optoelectronics Lab.
  • Computer Network Lab.
  • Department of Electrical Engineering
  • Electrical and Computer Engineering, Korea University
  • Department of Electronics Engineering
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • School of Electrical, Engineering Korea University
  • Samsung

External person

Se Jin Park

  • Korea Institute of Science and Technology
  • Department of Chemical and Biological Engineering, Korea University
  • Clean Energy Center
  • Korea University
  • Department of Material and Science and Engineering, Korea University
  • Clean Energy Research Centre, Korea Institute of Science and Technology
  • Department of Chemical and Biological Engineering, College of Engineering, Korea University
  • Center of Fuel Cell Research
  • Department of Electronic Engineering
  • Fuel Cell Center
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Material Science and Engineering
  • Graduate School of Information Security, Korea University
  • Department of Materials Science and Engineering, Korea University Anam
  • Dept. of Chemical and Biological Engineering, Korea University
  • Graduate School of Information Security, CIST, Korea University 1
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • University of Texas at Austin
  • Hallym University

External person

Tae Chan Kim

  • Samsung
  • Korea University
  • Optoelectronics Lab.
  • System LSI Business, Samsung Electronics
  • Department of Electrical Engineering

External person

Soonsung Ahn

  • Korea University

External person

Sunghwa Ok

  • Korea University
  • Optoelectronics Lab.
  • Computer Network Lab.
  • Department of Electrical Engineering
  • Electrical and Computer Engineering, Korea University

External person

Hoonki Kim

  • Korea University
  • Department of Electronic Engineering
  • School of Electrical Eng.
  • Computer Network Lab.
  • Optoelectronics Lab.
  • Electrical and Electronics Engineering Department
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electronics and Electrical Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Electrical and Computer Engineering, Korea University
  • Department of Electrical Engineering
  • School of Electrical, Engineering Korea University
  • Samsung

External person

Yunsaing Kim

  • SK Hynix Inc
  • SK Corporation
  • SK Hynix Inc.

External person

Soo Bin Lim

  • Korea University
  • Department of Nano-Semiconductor

External person

Seongcheol Kim

  • Korea University

External person

In Chul Hwang

  • Dankook University
  • Pohang University of Science and Technology
  • Sch. of Environ. Sci. and Eng.
  • Samsung
  • Korea University
  • Development Division
  • Corporate Research
  • Kangwon National University
  • Department of Electrical and Electronic Engineering
  • Department of Electrical Engineering
  • LG Corporation
  • Global Foundries, Inc.
  • University of Illinois at Urbana-Champaign

External person

Seong Ook Jung

  • Univ of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • T-RAM Inc.
  • University of Illinois at Urbana-Champaign
  • Coordinated Science Laboratory
  • Department of Electrical and Computer Engineering
  • Yonsei University

External person

Jaegeun Oh

  • Compiler and Microarchitecture Laboratory
  • Korea University

External person

Jin Woo Kim

  • Hanyang University
  • Department of Materials Science and Engineering, Hanyang University
  • Research Institute of Information and Communication Technology, Korea University
  • Korea University
  • Department of Electrical Engineering
  • Mokpo National University
  • Samsung
  • Hyundai Mobis

External person

Seung Moon Yoo

  • Dept. of Elec. and Comp. Engineering
  • Univ of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Univ. Illinois at Urbana-Champaign
  • Coordinated Science Laboratory
  • Dept. of Electrical and Comp. Eng.

External person

Philip K T Mok

  • Hong Kong University of Science and Technology
  • Dept. of Electronic and Computer Engineering

External person

Paul Myers

  • University of Michigan, Ann Arbor
  • Massachusetts Institute of Technology

External person

Seok Soo Yoon

  • Korea University
  • Department of Electronic Engineering
  • Computer Network Lab.
  • Optoelectronics Lab.
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Electrical and Computer Engineering, Korea University
  • Department of Electrical Engineering

External person

J. You

  • SK Corporation
  • Korea University
  • Department of Nano-Semiconductor
  • Electrical and Electronics Engineering Department
  • Department of Electronics and Electrical Engineering, Korea University
  • SK Hynix Inc.

External person

Jin Han Kim

  • Korea University

External person

Dong Seok Kim

  • Department of Electrical Engineering
  • Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University

External person

Sooho Park

  • Korea University

External person

Phuong Mau

  • Korea University
  • School of Electrical Eng.
  • Electrical and Electronics Engineering Department
  • Department of Electronics and Electrical Engineering, Korea University

External person

Chan Hui Jeong

  • Department of Electrical Engineering, Korea University
  • SK Corporation
  • Computer Network Lab.
  • ASIC Design Lab.
  • Korea University
  • Department of Electronic Engineering
  • Department of Nano-Semiconductor
  • School of Electrical Eng.
  • Robotics Laboratory
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • School of Electrical Engineering, Korea University
  • Nanoelectronics Laboratory
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • School of Electrical, Engineering Korea University
  • SK Hynix Inc.

External person

Jun Hyun Chun

  • SK Hynix Inc.
  • SK Corporation

External person

Junwon Jung

  • Korea University

External person

Yogendera Kumar

  • Korea University
  • Optoelectronics Lab.
  • Electrical and Electronics Engineering Department
  • Faculty of Electronics and Electrical Eng.
  • ASIC Design Lab.
  • Computer Network Lab.
  • Department of Electronics and Electrical Engineering, Korea University
  • Department of Electrical Engineering

External person

Jihwan Kim

  • Korea University

External person

Jaeil Kim

  • SK Hynix Inc
  • SK Corporation
  • SK Hynix Inc.

External person

Suyoung Bang

  • University of Michigan, Ann Arbor
  • Intel

External person

Kisoo Kim

  • Korea University

External person

Won Joo Yun

  • SK Hynix Inc
  • Hynix Semiconductor
  • Graphics Memory Design Team
  • Korea University
  • Computer Network Lab.
  • Electrical and Computer Engineering, Korea University
  • SK Hynix Inc.
  • SK Corporation

External person

Chan Keun Kwon

  • ASIC Design Lab.
  • Korea University
  • Mando R and D Center
  • Department of Electronic Engineering
  • School of Electrical Eng.
  • Department of Nano-Semiconductor
  • Computer Network Lab.
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Electrical and Computer Engineering, Korea University

External person

Dongju Lim

  • Korea University
  • Department of Electronics Engineering
  • SK Hynix Inc.
  • SK Corporation

External person

Jeongsik Yoo

  • Samsung
  • Korea University

External person

Youngsun Han

  • Kyungil University
  • Department of Electronic Engineering
  • Korea University
  • School of Electrical Eng.
  • Computer Network Lab.
  • School of Railway and Electrical Engineering, Kyungil University
  • Optoelectronics Lab.
  • Department of Electronic Engineering, Kyungil University
  • Department of Electronic Engineering
  • 202 2nd Engineering Building
  • Electrical and Computer Engineering, Korea University
  • School of Electrical and Railway Engineering, Kyungil University
  • Department of Electrical Engineering
  • School of Electrical, Engineering Korea University
  • Kyungil University

External person

Sangdon Jung

  • Korea University
  • Dept. of Elect. Eng.
  • Computer Network Lab.
  • Electrical and Computer Engineering, Korea University

External person

Choonghwan Lee

  • Korea University
  • Department of Electronic Engineering
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University

External person

Sangsu Lee

  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • School of Electrical, Engineering Korea University
  • Electrical and Electronics Engineering Department

External person

Wanyeong Jung

  • University of Michigan, Ann Arbor

External person

Ki Han Kim

  • SK Hynix Inc
  • SK Hynix Inc.
  • SK Corporation

External person

Hae Kang Jung

  • SK Hynix Inc.
  • SK Corporation

External person

Jaesik Lee

  • University of Illinois at Urbana-Champaign

External person

Hee Jun Kim

  • Hanyang University
  • School of Electrical Engineering and Computer Science
  • Sch. of Elect. Engin. and Com. Sci.
  • Korea University

External person

Seung Joon Seok

  • Korea University
  • Kyungnam University
  • Optoelectronics Lab.
  • Department of Electronic Engineering
  • Dep. of Computer Engineering
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Institute for Nano Science, Korea University

External person

Kiwook Kim

  • Pluris Incorporation
  • Brocade Communications Systems, Inc.
  • Pluris, Inc.
  • University of Illinois at Urbana-Champaign

External person

Changkyu Choi

  • SK Corporation
  • SK Hynix Inc.

External person

Nak Kyu Park

  • SK Hynix Inc
  • SK Hynix Inc.
  • SK Corporation

External person

Seok Ryong Yoon

  • Korea University
  • Department of Electronic Engineering
  • Optoelectronics Lab.
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Department of Electrical Engineering

External person

Kyung Whan Kim

  • SK Hynix Inc
  • SK Hynix Inc.
  • SK Corporation

External person

Chang Ho An

  • Sungkyunkwan University
  • School of Electrical and Computer Engineering

External person

Sung Bae Park

  • SAMSUNG Electronics Corporation
  • System LSI Division
  • Samsung
  • Processor Architecture Lab.
  • Processor Architecture Lab.
  • Processor Architecture Lab., SOC R and D Center, System LSI Division
  • System LSI Division

External person

Taehyeong Park

  • Korea University

External person

Chul Hee Kang

  • Korea Institute of Science and Technology
  • Korea University1
  • Korea University
  • Korea University1
  • Optoelectronics Lab.
  • Department of Electronic Engineering
  • School of Electrical Eng.
  • Department Electronics and Computer Engineering
  • Robotics Laboratory
  • Department of Material Science and Engineering
  • Nano Device Research Center
  • School of Electrical and Engineering, Korea University
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • School of Electrical Engineering, Korea University
  • Computer Network Lab.
  • Nanoelectronics Laboratory
  • Department of Electrical Engineering
  • Compiler and Microarchitecture Laboratory
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • School of Electrical, Engineering Korea University
  • Nano Device Research Center, Korea Institute of Science and Technology
  • Department of Materials Science and Enginnering
  • Department of Electronics Engineering

External person

Byoung Joo Yoo

  • Seoul National University
  • Korea University
  • Silicon Image
  • School of Electrical Engineering and Computer Science

External person

Nam Gyu Rye

  • SK Hynix Inc
  • SK Hynix Inc.
  • SK Corporation

External person

Seok Ryung Yoon

  • Korea University

External person

Daejung Shin

  • Electrical and Electronics Engineering Department
  • Korea University
  • Doestek Corporation

External person

Deog Kyoon Jeong

  • Seoul National University
  • Korea University
  • Silicon Image
  • School of Electrical Engineering and Computer Science

External person

Debashis Dhar

  • Doestek Co. Ltd.
  • DOESTEK, Ltd.
  • Korea University
  • Optoelectronics Lab.
  • Department of Electronic Engineering
  • Computer Network Lab.
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Institute for Nano Science, Korea University

External person

Sang Yoon Lee

  • Seoul National University
  • Silicon Image
  • Korea University

External person

K. S. Kim

  • Electronics and Telecommunications Research Institute
  • Colorado State University
  • Korea University
  • Dept. of Elect. Eng.
  • Dept. of Mat. Sci. and Engineering
  • Computer Network Lab.
  • Department of Material Science and Engineering
  • Convergence Components and Materials Research Laboratory, Electronics and Telecommunications Research Institute (ETRI)
  • Department of Advanced Materials Science and Engineering, Korea University
  • Department of Electronic Engineering
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Electrical and Computer Engineering, Korea University
  • Department of Materials Science and Enginnering
  • Department of Mater. Sci. and Eng.
  • Department of Electrical Engineering, Institute for Nano Science, Korea University

External person

Hyunho Chu

  • Korea University
  • Optoelectronics Lab.
  • Computer Network Lab.
  • Department of Electrical Engineering

External person

E. Kim

  • Korea University
  • Seoyoung Engineering

External person

Eun Young Park

  • SK Hynix Inc
  • SK Hynix Inc.
  • SK Corporation

External person

Haerang Choi

  • SK Corporation
  • SK Hynix Inc.

External person

Daeyun Shim

  • Silicon Image, Inc.
  • Korea University
  • Silicon Image
  • School of Electrical Engineering and Computer Science
  • Seoul National University

External person

Youngbog Yoon

  • Korea University
  • SK Hynix Inc.
  • SK Corporation

External person

Jayoung Kim

  • Korea University

External person

Kwang Hyun Kim

  • SK Hynix Inc
  • SK Hynix Inc.
  • SK Corporation

External person

Kyeong Min Kim

  • SK Corporation

External person

Hyung Rok Lee

  • Seoul National University
  • Korea University
  • Silicon Image
  • School of Electrical Engineering and Computer Science

External person

Gilwon Yoon

  • Electrical and Computer Engineering, Korea University
  • Korea University

External person

Taejin Kim

  • Doestek Corporation

External person

Jinhee Cho

  • SK Corporation
  • SK Hynix Inc
  • SK Hynix Inc.

External person

Jaehong Ko

  • Korea University
  • Computer Network Lab.
  • Electrical and Computer Engineering, Korea University
  • Department of Electronics, Korea
  • Korea

External person

Jintae Kim

  • Konkuk University
  • Department of Electronics Engineering

External person

Bong Young Chung

  • Samsung
  • Korea University
  • System LSI Business, Samsung Electronics
  • Molecular Opto-Electronics Laboratory

External person

Kyu Young Kim

  • SK Hynix Semiconductor Inc.
  • SK Corporation
  • SK Hynix Inc
  • Korea University
  • Optoelectronics Lab.
  • School of Electrical Eng.
  • Computer Network Lab.
  • ASIC Design Lab.
  • Electrical and Electronics Engineering Department
  • DRAM Development Division
  • School of Electrical and Engineering, Korea University
  • Department of Electronics and Electrical Engineering, Korea University
  • Department of Electrical Engineering
  • Electrical and Computer Engineering, Korea University
  • Compiler and Microarchitecture Laboratory
  • SK Hynix Inc.

External person

Young Kyoung Choi

  • SK Hynix Inc.
  • SK Corporation

External person

Jong Ho Jung

  • SK Hynix Inc.
  • SK Corporation

External person

Bong Young Chung

  • Samsung
  • System LSI Business, Samsung Electronics

External person

Tagjong Lee

  • Korea University
  • Electrical and Electronics Engineering Department
  • Faculty of Electronics and Electrical Eng.
  • Department of Electronics and Electrical Engineering, Korea University

External person

Junhua Shen

  • Analog Devices, Inc.

External person

Kyunghoon Chung

  • Korea University

External person

Kyeong Min Kim

  • Korea University

External person

Jongsam Kim

  • SK Corporation
  • SK Hynix Inc
  • SK Hynix Inc.

External person

Sayoon Kang

  • Samsung
  • Package Development Team

External person

Jaehun Jun

  • Korea University

External person

Jaehun Jun

  • Korea University

External person

Jeewan Lee

  • SK Corporation

External person

Yoonjae Choi

  • Korea University

External person

[No Value] Aurangozeb

  • Korea University
  • Department of Electronic Engineering
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University

External person

Jung Choi Young

  • Hynix Semiconductor
  • Graphics Memory Design Team
  • SK Hynix Inc.
  • SK Corporation

External person

S. K. Lee

  • LS Cable and System Ltd.
  • Advanced RandD Center
  • SK Hynix Inc.
  • SK Corporation

External person

Taeyoon Kim

  • Korea University
  • Computer Network Lab.
  • Electrical and Computer Engineering, Korea University
  • Department of Electronics Engineering
  • Korea Electronics Technology Institute

External person

Koji Nii

  • Tokushima University
  • Kobe University

External person

Joonyeon Chang

  • Center for Spintronics Research
  • Korea Institute of Science and Technology
  • Nano Device Research Center, Korea Institute of Science and Technology
  • University of Science and Technology UST
  • Spin Convergence Research Center
  • Spin Convergence Research Center, Korea Institute of Science and Technology (KIST)
  • Department of Nano Electronics
  • Massachusetts Institute of Technology

External person

Beom Ju Shin

  • SK Hynix Inc.
  • SK Corporation

External person

Sun Kyung Shin

  • LG Corporation
  • Circuit Research Division

External person

Edith Beigné

  • Commissariat à l’énergie atomique et aux énergies alternatives

External person

Wonki Park

  • Korea Electronics Technology Institute

External person

Joong Sik Kih

  • SK Hynix Inc
  • Hynix Semiconductor
  • Hanyang University
  • RFID
  • Department of Nano-Semiconductor Engineering
  • R and D Division
  • SK Hynix Inc.

External person

Bipul C. Paul

  • Purdue University

External person

Peter Harliman

  • LG Digital Media Company
  • LG Corporation
  • Compiler and Advanced Computer Systems Laboratory
  • Korea University

External person

Sudhakar Pamarti

  • Korea University
  • Department of Electrical Engineering
  • University of California at Los Angeles
  • Department of Electronic Engineering
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University

External person

Mircea R. Stan

  • University of Massachusetts
  • University Politehnica of Bucharest

External person

Sangjin Kim

  • Samsung
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Mobile Communication Division, Samsung Electronics Co., Ltd.
  • Korea University

External person

Hyung Dong Lee

  • SK Hynix Inc
  • SK Hynix Inc.
  • SK Corporation

External person

Sanggui Jo

  • Samsung
  • Package Development Team

External person

Woonhyung Heo

  • Korea University
  • Advanced Integrated Systems Lab.

External person

Jung Hoon Park

  • Biomedical Engineering Research Center and Department of Radiology
  • University of Ulsan
  • SK Hynix Inc.
  • SK Corporation

External person

Ying Khai Teh

  • Dept. of Electronic and Computer Engineering
  • Hong Kong University of Science and Technology

External person

Xuan Tu Tran

  • Vietnam National University, Hanoi
  • SYSlab.

External person

Soojeoung Park

  • Samsung
  • Package Development Team

External person

Kyongwon Min

  • Korea Electronics Technology Institute

External person

Jose Pineda De Gyvez

  • Eindhoven University of Technology

External person

Kang Youl Lee

  • SK Hynix Inc
  • SK Hynix Inc.
  • SK Corporation

External person

Patrick Schaumont

  • Ghent University
  • University of California at Los Angeles

External person

Mark M. Tehranipoor

  • University of Florida

External person

Min Su Jeong

  • Korea University
  • Optoelectronics Lab.
  • Computer Network Lab.
  • RAONTECH Inc.
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Seoyoung Engineering

External person

Dong Hyun Kim

  • Korea University
  • Compiler and Microarchitecture Laboratory, School of Electrical and Computer Engineering, Korea University
  • School of Electrical Eng.
  • ?Gangneung-Wonju National University
  • Kyungpook National University

External person

Sang Yong Lee

  • University of Korea
  • Korea Electronics Technology Institute
  • Korea University
  • Busan Medical Center
  • Optoelectronics Lab.
  • SoC Research Center
  • Computer Network Lab.
  • Department Electronics and Computer Engineering
  • Department of Internal Medicine
  • Department of Electrical Engineering
  • Electrical and Computer Engineering, Korea University

External person

Changhun Park

  • Korea University

External person

Gyusung Kang

  • Korea University

External person

Yonggu Kang

  • SK Corporation
  • SK Hynix Inc.

External person

Mehran Mozaffari Kermani

  • University of Tehran
  • Western University

External person

Houman Homayoun

  • Sharif University of Technology
  • University of California at Irvine
  • University of Victoria BC

External person

Hai Helen Li

  • Purdue University
  • Tsinghua University

External person

Fabio Sebastiano

  • University of Pisa
  • Delft University of Technology

External person

Y. Baek

  • Korea University

External person

Magdy S. Abadir

  • University of Saskatchewan
  • University of Southern California
  • Alexandria University

External person

Kim Jungmoon

  • Korea University
  • Computer Network Lab.
  • Electrical and Computer Engineering, Korea University

External person

Rolf Drechsler

  • Goethe University Frankfurt

External person

Suk H. Han

  • KIST
  • Korea Institute of Science and Technology
  • Korea Inst of Science and Technology
  • Korea Inst. of Science/Technology
  • Korea Inst. of Sci. and Technology
  • Spin Convergence Research Center, Korea Institute of Science and Technology
  • Korea Inst. of Science and Tech.
  • Tohoku University
  • Korea Inst. of Sci. and Technol.
  • Korea Inst. Sci. Technol., P.O. B.
  • Korea University
  • Center for Spintronics Research
  • Nano Device Research Center
  • Spin Convergence Research Center
  • Thin Film Technology Research Center
  • Thin Film Materials Research Center
  • Magnetic Materials Laboratory
  • Magnetic Materials Laboratory
  • R. and D. Division
  • Hankook Core Company Ltd.
  • Dept. of Mat. Sci. and Engineering
  • Spin Convergence Research Center, Korea Institute of Science and Technology (KIST)
  • Nano Device Research Center, Korea Institute of Science and Technology

External person

Ruonan Han

  • Cornell University
  • Fudan University
  • University of Florida

External person

Sungjun Moon

  • Korea University

External person

Pasquale Corsonello

  • University of Naples Federico II

External person

Young Ho Kwaks

  • Korea University

External person

Chirn Chye Boon

  • Nanyang Technological University

External person

Areum Kim

  • System IC Business Team
  • Korea University
  • Compiler and Microarchitecture Laboratory
  • Power Quality Technology
  • LG Corporation

External person

Hyonchol Kim

  • Samsung
  • Package Development Team

External person

Dongkyu Park

  • Korea University

External person

Yoonsung Lee

  • SK Hynix Inc.
  • SK Corporation

External person

Jonghwan Kim

  • SK Hynix Inc.
  • SK Corporation

External person

Tae Hyoung Tony Kim

  • University of Minnesota Twin Cities
  • Korea University

External person

Rajiv Joshi

  • IBM
  • Indian Institute of Technology Bombay
  • Massachusetts Institute of Technology
  • Columbia University

External person

Inho Park

  • Korea University

External person

Chip Hong Chang

  • National University of Singapore
  • Nanyang Technological University

External person

Meejoung Kim

  • Department of Electronics Engineering
  • Korea University
  • Research Institute of Information and Communication Technology, Korea University
  • School of Electrical, Engineering Korea University
  • Department of Electrical Engineering

External person

Kawngjin Bae

  • Samsung
  • Package Development Team

External person

Valerio Vignoli

  • University of Florence

External person

Kyoungsei Choi

  • Samsung
  • Package Development Team

External person

Kyung Hoon Kim

  • SK Hynix Inc.
  • SK Corporation

External person

Chun Huat Heng

  • University of Illinois at Urbana-Champaign
  • National University of Singapore

External person

Kungryun Yoon

  • Korea University

External person

Gyutae Park

  • SK Hynix Inc.
  • SK Corporation

External person

Changsung Choi

  • Computer Network Lab.
  • Korea University
  • Electrical and Computer Engineering, Korea University

External person

Poki Chen

  • National Taiwan University

External person

Huawei Li

  • XiangTan University
  • CAS - Institute of Computing Technology

External person

Jin Seock Ma

  • Korea Institute of Science and Technology
  • Center for Spintronics Research

External person

Yoonmyung Lee

  • Pohang University of Science and Technology
  • University of Michigan, Ann Arbor

External person

D. H. Kwon

  • SK Hynix Inc
  • Korea University
  • Computer Network Lab.
  • School of Electrical Eng.
  • Compiler and Microarchitecture Laboratory
  • Power Quality Technology
  • Electrical and Computer Engineering, Korea University
  • SK Hynix Inc.
  • SK Corporation

External person

Massimo Alioto

  • University of Catania
  • National University of Singapore

External person

Younga Cho

  • Korea University
  • Compiler and Microarchitecture Laboratory, School of Electrical and Computer Engineering, Korea University

External person

Ioannis Savidis

  • University of Rochester
  • Duke University

External person

Hong Seol Cha

  • Korea University

External person

Hojin Park

  • Samsung Company
  • Samsung Display Co. Ltd.

External person

Jaejin Lee

  • SK Hynix Inc.
  • SK Corporation

External person

Ook Hong

  • Seoyoung Engineering

External person

Suki Kim

  • Department of Electrical Engineering
  • Korea University
  • University of California at Santa Cruz
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Chung-Ang University

External person

Sungjoo Hong

  • SK Corporation
  • SK Hynix Inc.

External person

Heesun Ahn

  • Jeonbuk National University
  • Department of Electronics and Information Engineering

External person

Seok Joon Park

  • Samsung
  • System LSI Business, Samsung Electronics

External person

Chu Hyunho

  • Korea University
  • Computer Network Lab.
  • Electrical and Computer Engineering, Korea University

External person

Minsu Park

  • SK Corporation
  • SK Hynix Inc.

External person

Woo Seok Choi

  • Seoul National University

External person

Masanori Hashimoto

  • Kyoto University

External person

Yong Hoon Kim

  • SK Hynix Inc.
  • SK Corporation

External person

P. T. Hong

  • Vietnam National University, Hanoi

External person

Sungchul Lee

  • Korea Electronics Technology Institute

External person

Gyungmin Kim

  • Korea University
  • Department of Micro/Nano Systems, Korea University
  • Department of Micro/Nano Systems

External person

Anirban Sengupta

  • Ryerson University

External person

Ju Hyung Lee

  • Computer Network Lab.
  • Korea University
  • Electrical and Computer Engineering, Korea University
  • Compiler and Microarchitecture Laboratory, School of Electrical and Computer Engineering, Korea University
  • University of Southern California

External person

Deukhyoun Heo

  • Georgia Institute of Technology

External person

Mingoo Seok

  • Seoul National University
  • University of Michigan, Ann Arbor

External person

Hyungsoo Kim

  • SK Hynix Inc.
  • SK Corporation

External person

S. M. Yo

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Coordinated Science Laboratory

External person

Kynnyun Kim

  • Korea Electronics Technology Institute
  • SoC Research Center

External person

Jinuk Luke Shin

  • Oracle Corporation

External person

Zhengya Zhang

  • University of California at Berkeley
  • University of Waterloo

External person

Wei Zhang

  • Princeton University
  • Harbin Institute of Technology

External person

Jinil Chung

  • SK Hynix Inc.
  • SK Corporation

External person

Haerang Choi

  • SK Hynix Inc.
  • SK Corporation

External person

Junil Moon

  • Department of Electrical Engineering, Korea University
  • School of Electrical Engineering, Korea University
  • Computer Network Lab.
  • School of Electrical Engineering, Korea University Seoul
  • Korea University
  • SK Hynix Inc.
  • Department of Electronic Engineering
  • Department of Nano-Semiconductor
  • Robotics Laboratory
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Nanoelectronics Laboratory
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • School of Electrical, Engineering Korea University
  • Electrical and Computer Engineering, Korea University
  • SK Corporation

External person

Jong Ho Kang

  • SK Hynix Inc.
  • SK Corporation

External person

Jinyoup Cha

  • SK Corporation
  • SK Hynix Inc.

External person

Stacey Weber

  • Rutgers - The State University of New Jersey, New Brunswick

External person

Doyoun Kim

  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University

External person

Jongchan Choi

  • Korea Electronics Technology Institute
  • SoC Research Center

External person

Boeun Kim

  • Korea University
  • Optoelectronics Lab.
  • Computer Network Lab.
  • Department of Electrical Engineering

External person

Eric Martina

  • Univ of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hunsub Park

  • Korea University

External person

Andreas Burg

  • Swiss Federal Institute of Technology Zurich

External person

Jaydeep Kulkarni

  • Purdue University

External person

Xiaoqing Wen

  • Tsinghua University
  • Hiroshima University
  • Osaka University

External person

Ajay Joshi

  • University of Mumbai
  • Georgia Institute of Technology

External person

Manho Seung

  • SK Hynix Inc.
  • SK Corporation

External person

Makoto Nagata

  • Hiroshima University
  • Gakushuin University

External person

Jeongsik Yoo

  • Korea University
  • Samsung
  • Memory Division
  • Department of Electronic Engineering
  • Memory Division, Samsung Electronics
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University

External person

Aida Todri-Sanial

  • California State University Long Beach
  • Bradley University
  • University of California at Santa Barbara

External person

Kunwoo Park

  • SK Hynix Inc
  • SK Hynix Inc.
  • SK Corporation

External person

Ki Wook Kim

  • University of Illinois at Urbana-Champaign
  • Brocade Communications Systems, Inc.

External person

Joon Goo Lee

  • Korea University
  • Computer Network Lab.
  • Compiler and Microarchitecture Laboratory, School of Electrical and Computer Engineering, Korea University
  • Compiler and Microarchitecture Laboratory
  • School of Electrical Eng.
  • Power Quality Technology
  • School of Electrical and Engineering, Korea University
  • Compiler and Advanced Computer Systems Laboratory
  • Electrical and Computer Engineering, Korea University

External person

Sang Ah Hyun

  • SK Corporation
  • SK Hynix Inc.

External person

Beom Jin Kim

  • LG Corporation

External person

Jonghwa Eom

  • Sejong University
  • Korea Institute of Science and Technology
  • Korea Inst. of Science and Tech.
  • Center for Spintronics Research
  • Nano Device Research Center
  • Institute of Fundamental Physics, Department of Physics, Sejong University
  • Department of Physics and Institute of Fundamental Physics
  • Nano Device Research Center, Korea Institute of Science and Technology

External person

Paolo Crovetti

  • Polytechnic University of Turin

External person

Seokwon Jang

  • Korea University

External person

Jung Dae Kim

  • Korea University
  • Department of Electronic Engineering
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University

External person

Jun Zhou

  • Newcastle University
  • University of Electronic Science and Technology of China

External person

Hyung Jun Kim

  • Nano Device Research Center, Korea Institute of Science and Technology
  • Korea Institute of Science and Technology
  • University of Science and Technology UST
  • Center for Spintronics Research
  • Spin Convergence Research Center
  • Department of Nano Electronics
  • Kwangwoon University

External person

Wanyeong Jung

  • University of Michigan, Ann Arbor

External person

Ju Hwan Shon

  • SK Hynix Inc
  • SK Hynix Inc.
  • SK Corporation

External person

Changmin Sim

  • Korea University

External person

Tsung Yi Ho

  • National Taiwan University
  • National Tsing Hua University

External person

Yangho Seo

  • Korea University
  • Department of Nano-Semiconductor

External person

Seungwook Kwack

  • SK Corporation
  • SK Hynix Inc.

External person

Seok Joong Hwang

  • Korea University
  • School of Electrical Eng.
  • Computer Network Lab.
  • Compiler and Microarchitecture Laboratory
  • Optoelectronics Lab.
  • School of Electrical and Engineering, Korea University
  • Power Quality Technology
  • Electrical and Computer Engineering, Korea University
  • Department of Electrical Engineering
  • School of Electrical, Engineering Korea University

External person

Jae Hwan Kim

  • SK Hynix Inc.
  • Korea University
  • SK Corporation

External person

Volkan Kursun

  • University of Rochester
  • Middle East Technical University

External person

Seunggeun Baek

  • SK Corporation
  • SK Hynix Inc.

External person

Yeongrok Lee

  • School of Electrical, Engineering Korea University
  • Korea University

External person

Kyungjin Jang

  • LG Corporation
  • Circuit Research Division

External person

Jiyong Park

  • Samsung
  • Mobile Communication Division, Samsung Electronics Co., Ltd.

External person

Yuri Lim

  • SK Corporation
  • SK Hynix Inc.

External person

Huong Giang Nguyen

  • Korea University
  • Compiler and Microarchitecture Laboratory
  • Power Quality Technology

External person

Ibrahim Abe M. Elfadel

  • Massachusetts Institute of Technology

External person

Partha Pratim Pande

  • Washington State University Pullman

External person

Mark Zwolinski

  • University of Southampton

External person

Byung Gun Joung

  • Korea University
  • Department of Nano-Semiconductor

External person

Jan Genoe

  • Interuniversitair Micro-Elektronica Centrum

External person

Tughrul Arslan

  • University of Edinburgh

External person

Vasilis F. Pavlidis

  • University of Rochester
  • Democritus University of Thrace

External person

Jong Sang Baek

  • LG Corporation

External person

Shiro Dosho

  • Tokyo Institute of Technology

External person

Ju Hwan Sohn

  • SK Hynix Inc
  • SK Hynix Inc.
  • SK Corporation

External person

Yuh Shyan Hwang

  • National Taiwan University

External person

Yusuke Oike

  • Sony Group Corporation

External person

Baker Mohammad

  • University of Texas at Austin
  • University of New Mexico
  • Arizona State University

External person

Jiang Xu

  • Princeton University

External person

Jungwan Lee

  • SK Corporation
  • SK Hynix Inc.

External person

Tanay Karnik

  • University of Illinois at Urbana-Champaign

External person

Meng Fan Chang

  • National Yang Ming Chiao Tung University
  • Pennsylvania State University

External person

Jong Pil Son

  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Korea University
  • Samsung
  • Memory Division, Samsung Electronics

External person

Hoonsoo Park

  • Korea University

External person

Prabhat Mishra

  • University of California at Irvine

External person

Jinseok Oh

  • SK Hynix Inc.
  • SK Corporation

External person

Sangchan Han

  • Korea University
  • Optoelectronics Lab.
  • Computer Network Lab.
  • Department of Electrical Engineering

External person

Yao Wen Chang

  • University of Texas at Austin
  • National Taiwan University

External person

Jong Min Kim

  • Korea University

External person

Jonghwan Kim

  • SK Corporation
  • SK Hynix Inc
  • SK Hynix Inc.

External person