Alioto, M., Abadir, M. S., Arslan, T., Boon, C. C., Burg, A., Chang, C. H., Chang, M. F., Chang, Y. W., Chen, P., Corsonello, P., Crovetti, P., Dosho, S., Drechsler, R., Elfadel, I. A. M., Han, R., Hashimoto, M., Heng, C. H., Heo, D., Ho, T. Y. & Homayoun, H.
& 37 others,
Hwang, Y. S., Joshi, A., Joshi, R. V., Karnik, T., Kim, C., Kim, T. H. T., Kulkarni, J., Kursun, V., Lee, Y., Li, H. H., Li, H., Mishra, P., Mohammad, B., Kermani, M. M., Nagata, M., Nii, K., Pande, P. P., Paul, B. C., Pavlidis, V. F., De Gyvez, J. P., Savidis, I., Schaumont, P., Sebastiano, F., Sengupta, A., Seok, M., Stan, M. R., Tehranipoor, M. M., Todri-Sanial, A., Verhelst, M., Vignoli, V., Wen, X., Xu, J., Zhang, W., Zhang, Z., Zhou, J., Zwolinski, M. & Weber, S.,
2019 Feb 1,
In: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 27,
2,
p. 253-280 28 p., 8629340.
Research output: Contribution to journal › Review article › peer-review