Calculated based on number of publications stored in Pure and citations from Scopus
1997 …2023

Research activity per year

If you made any changes in Pure these will be visible here soon.

Network

Gregory Freeman

  • IBM Microelectronics
  • IBM Microelectron. S.R./D.C.
  • IBM Semiconductor Research and Development Center
  • IBM Microelectronics Division
  • East Fishkill Facility
  • IBM
  • MSRDC
  • M/S AE1
  • IBM Semiconduct. Res./Devmt. Ctr.
  • Semiconductor Res. and Devmt. Ctr.
  • IBM Communications R and D Center
  • MS EM1
  • IBM Semiconductor R and D Center
  • IBM Microelectronics Semiconductor Research and Development Center(SRDC)
  • SRDC
  • MS 862D
  • M/S EM1
  • IBM Microelectronics Semicon. Res.
  • IBM
  • IBM Microelectronics
  • IBM
  • IEEE
  • Systems and Technology Group
  • Communications Research and Development Center (CRDC)
  • Global Foundries, Inc.
  • IBM Research

External person

David Ahlgren

  • IBM Microelectronics
  • IBM Microelectronics Semicon. Res.
  • IBM Microelectronics Division
  • East Fishkill Facility
  • IBM
  • MSRDC
  • M/S AE1
  • IBM Semiconduct. Res./Devmt. Ctr.
  • Semiconductor Res. and Devmt. Ctr.
  • M/S EM1
  • IBM Semiconductor R and D Center
  • IBM Communications R and D Center
  • IBM Microelectronics Semiconductor Research and Development Center(SRDC)
  • IBM Semiconductor Research and Development Center
  • IBM Microelectron. S.R./D.C.
  • IBM
  • IBM Microelectronics
  • IBM
  • Systems and Technology Group
  • Communications Research and Development Center (CRDC)
  • Global Foundries, Inc.
  • IBM Research

External person

Daekeun Yoon

  • School of Electrical Engineering, Korea University
  • School of Electrical Engineering, Korea University Seoul
  • Korea University
  • National Yang Ming Chiao Tung University
  • School of Electrical Engineering, Korea University
  • Robotics Laboratory
  • School of Electrical Eng.
  • International College of Semiconductor Technology
  • Nanoelectronics Laboratory
  • School of Electrical, Engineering Korea University
  • Department of Electronics Engineering

External person

Jungsoo Kim

  • School of Electrical Engineering, Korea University
  • Korea University
  • Nanoelectronics Laboratory
  • School of Electrical, Engineering Korea University
  • Electronics and Telecommunications Research Institute

External person

Jongwon Yun

  • School of Electrical Engineering, Korea University
  • School of Electrical Engineering, Korea University Seoul
  • Korea University
  • School of Electrical Engineering, Korea University
  • Leibniz-Institut fur innovative Mikroelektronik
  • Robotics Laboratory
  • School of Electrical Eng.
  • Optoelectronics Lab.
  • Computer Network Lab.
  • Nanoelectronics Laboratory
  • Institut fur innovative Mikroelektronik (IHP)
  • Innovations for High Performance Microelectronics
  • School of Electrical, Engineering Korea University
  • Department of Electrical Engineering
  • Samsung
  • SK Hynix Inc.
  • SK Corporation

External person

Kiryong Song

  • School of Electrical Engineering, Korea University Seoul
  • School of Electrical Engineering, Korea University
  • Korea University
  • School of Electrical Eng.
  • Robotics Laboratory
  • School of Electrical Engineering, Korea University
  • Nanoelectronics Laboratory
  • School of Electrical, Engineering Korea University
  • National Yang Ming Chiao Tung University
  • Samsung

External person

Alvin Joseph

  • IBM Microelectronics
  • IBM Microelectron. S.R./D.C.
  • IBM Microelectronics Division
  • Burlington Facility
  • IBM
  • MS 863C
  • Semiconductor Res. and Devmt. Ctr.
  • IBM Semiconductor R and D Center
  • IBM
  • IEEE
  • IBM Microelectronics Division
  • Communications Research and Development Center (CRDC)
  • Global Foundries, Inc.
  • IBM Research

External person

S. Subbanna

  • Semiconductor Res. and Devmt. Ctr.
  • M/S AE1
  • IBM Microelectronics
  • MS 863C
  • IBM
  • IBM Microelectronics
  • Global Foundries, Inc.
  • IEEE
  • IBM Research

External person

Junghwan Yoo

  • Korea University
  • Robotics Laboratory
  • School of Electrical Engineering, Korea University
  • Nanoelectronics Laboratory
  • School of Electrical, Engineering Korea University
  • Graduate School of Life Science and Biotechnology, Korea University

External person

Basanth Jagannathan

  • IBM Microelectronics
  • IBM Microelectron. S.R./D.C.
  • IBM Microelectronics Semicon. Res.
  • IBM Microelectronics Division
  • MSRDC
  • M/S AE1
  • IBM Semiconduct. Res./Devmt. Ctr.
  • Semiconductor Res. and Devmt. Ctr.
  • IBM Semiconductor R and D Center
  • IBM Communications R and D Center
  • IBM Microelectronics Semiconductor Research and Development Center(SRDC)
  • IBM
  • IEEE
  • Communications Research and Development Center (CRDC)
  • Global Foundries, Inc.
  • IBM Research

External person

David Greenberg

  • IBM Microelectronics
  • IBM T. J. Watson Research Center
  • SRDC
  • East Fishkill Facility
  • M/S AE1
  • IBM Semiconduct. Res./Devmt. Ctr.
  • IBM
  • IBM Communications R and D Center
  • IBM Microelectronics Semiconductor Research and Development Center(SRDC)
  • IBM
  • IBM Microelectronics Division
  • Communications Research and Development Center (CRDC)
  • Global Foundries, Inc.
  • IBM Research

External person

Doyoon Kim

  • Korea University
  • Robotics Laboratory
  • School of Electrical Engineering, Korea University
  • Nanoelectronics Laboratory
  • School of Electrical, Engineering Korea University
  • Sungkyunkwan University
  • ?Gangneung-Wonju National University

External person

Heekang Son

  • Korea University
  • Robotics Laboratory
  • School of Electrical Engineering, Korea University
  • Nanoelectronics Laboratory
  • School of Electrical, Engineering Korea University

External person

Andreas D. Stricker

  • MSRDC
  • IBM
  • Device Development and Modeling Department
  • Semiconductor Res. and Devmt. Ctr.
  • IBM Microelectronics
  • MS972
  • IBM Semiconductor R and D Center
  • MS 972C
  • IBM
  • IBM Systems and Technology Group
  • Global Foundries, Inc.

External person

M. Khater

  • M/S AE1
  • IBM T. J. Watson Research Center
  • Semiconductor Res. and Devmt. Ctr.
  • M/S EM1
  • IBM Microelectronics
  • IBM Semiconductor R and D Center
  • IBM Communications R and D Center
  • MS EM1
  • IBM Microelectronics Semiconductor Research and Development Center(SRDC)
  • IBM
  • IEEE
  • Global Foundries, Inc.
  • IBM Research

External person

Pallab Bhattacharya

  • IEEE
  • University of Michigan, Ann Arbor
  • Univ of Michigan
  • NASA Lewis Research Center
  • NASA Glenn Research Center
  • Radiation Lab.
  • Radiation Laboratory
  • HRL Laboratories
  • University of Michigan

External person

Sung Woo Hwang

  • University of Seoul
  • Korea Univ., Anam-Dong, S.
  • Korea Univ., Anam-dong, S.
  • Samsung
  • Korea University
  • Computer Network Lab.
  • Optoelectronics Lab.
  • Display and Nanosystem Laboratory, College of Engineering, Korea University
  • Compiler and Microarchitecture Laboratory
  • Institute of Quantum Information Processing and Systems
  • Department of Electronic Engineering
  • Robotics Laboratory
  • IEEE
  • Department of Electronics Engineering
  • School of Electrical Eng.
  • Power Quality Technology
  • School of Electrical Engineering, Korea University
  • Nanoelectronics Laboratory
  • Electrical and Computer Engineering, Korea University
  • Department of Electrical Engineering
  • Research Institute of Engineering and Technology, College of Engineering, Korea University
  • School of Electrical, Engineering Korea University
  • Samsung Advanced Institute of Technology
  • Future IT Center Communication Laboratory
  • Research Center for Time-Domain and Nano-Functional Devices
  • Samsung Advanced Institute of Technology, Samsung Electronics
  • Research Center for Time-domain Nano-functional Devices
  • Frontier Research Laboratory
  • Research Center for Time-Domain Nano-Functional Device, Samsung Advanced Institute of Technology
  • Department of Mechanical Engineering, Korea University, Anam-Dong, Sungbuk-Gu, Seoul 136-713

External person

Kenneth Stein

  • IBM Microelectronics
  • IBM Microelectronics Division
  • East Fishkill Facility
  • IBM
  • M/S AE1
  • Semiconductor Res. and Devmt. Ctr.
  • IBM T. J. Watson Research Center
  • M/S EM1
  • IBM Semiconductor R and D Center
  • IBM Communications R and D Center
  • IBM Microelectronics Semiconductor Research and Development Center(SRDC)
  • IBM
  • IEEE
  • Communications Research and Development Center (CRDC)
  • Global Foundries, Inc.
  • IBM Research

External person

Fernando Guarin

  • IBM Microelectron. S.R./D.C.
  • East Fishkill Facility
  • IBM Semiconduct. Res./Devmt. Ctr.
  • IBM Microelectronics
  • IBM Semiconductor R and D Center
  • IBM
  • IBM Microelectronics Division
  • Semiconductor Res. and Devmt. Ctr.
  • Global Foundries, Inc.
  • IBM Research

External person

Kathryn Schonenberg

  • IBM Microelectronics
  • IBM Microelectronics Semicon. Res.
  • M/S AE1
  • Semiconductor Res. and Devmt. Ctr.
  • IBM T. J. Watson Research Center
  • M/S EM1
  • IBM Communications R and D Center
  • IBM Microelectronics Semiconductor Research and Development Center(SRDC)
  • IBM
  • Communications Research and Development Center (CRDC)
  • Global Foundries, Inc.
  • IBM Research

External person

Mehmet Kaynak

  • IHP GmbH
  • IHP
  • Institut fur innovative Mikroelektronik (IHP)
  • IHP
  • Leibniz-Institut fur innovative Mikroelektronik
  • Innovations for High Performance Microelectronics
  • IHP

External person

Yongho Oh

  • Korea University
  • School of Electrical Eng.
  • Compiler and Microarchitecture Laboratory
  • Power Quality Technology
  • School of Electrical and Engineering, Korea University
  • Samsung

External person

J. Johnson

  • IBM
  • Global Foundries, Inc.

External person

Donghyun Kim

  • Hongik University
  • Korea University

External person

Shwu Jen Jeng

  • IBM Microelectronics
  • MSRDC
  • M/S AE1
  • Semiconductor Res. and Devmt. Ctr.
  • M/S EM1
  • IBM Semiconductor R and D Center
  • IBM Communications R and D Center
  • IBM Microelectronics Semiconductor Research and Development Center(SRDC)
  • IBM
  • Communications Research and Development Center (CRDC)
  • Global Foundries, Inc.
  • IBM Research

External person

Namhyung Kim

  • School of Electrical Engineering, Korea University
  • School of Electrical Engineering, Korea University Seoul
  • Korea University
  • School of Electrical Eng.
  • Robotics Laboratory
  • Compiler and Microarchitecture Laboratory
  • Power Quality Technology
  • Nanoelectronics Laboratory
  • School of Electrical, Engineering Korea University

External person

Z. Yang

  • IBM
  • Global Foundries, Inc.
  • IBM Research

External person

John D. Cressler

  • Georgia Institute of Technology
  • Georgia Technical University
  • Georgia Tech.
  • Sch. of Elec./Computer Engineering
  • School of Electrical and Computer Engineering

External person

J. Dunn

  • Global Foundries, Inc.
  • IBM

External person

David Harame

  • IBM Microelectronics
  • IBM Microelectronics Division
  • Burlington Facility
  • IBM
  • MS 863C
  • IBM Semiconduct. Res./Devmt. Ctr.
  • IBM
  • IBM Microelectronics Division
  • Communications Research and Development Center (CRDC)
  • Semiconductor Res. and Devmt. Ctr.
  • Global Foundries, Inc.
  • IBM Research

External person

Edward T. Croke

  • Univ of Michigan
  • NASA Lewis Research Center
  • Hughes Research Laboratory
  • Hughes Research Laboratories, Inc.
  • LLC
  • HRL Laboratories
  • University of Michigan, Ann Arbor
  • NASA Glenn Research Center
  • Radiation Lab.

External person

Sooyeon Kim

  • School of Electrical Engineering, Korea University Seoul
  • Korea University
  • Robotics Laboratory
  • Compiler and Microarchitecture Laboratory
  • Optoelectronics Lab.
  • School of Civil, Environmental, & Architectural Engineering, Korea University
  • School of Electrical Engineering, Korea University
  • Power Quality Technology
  • Nanoelectronics Laboratory
  • Schhool of Electrical Engineering
  • School of Electrical, Engineering Korea University
  • Department of Electrical Engineering

External person

Hyun Chul Kim

  • Sejong University
  • Korea University
  • Virginia Polytechnic Institute and State University
  • Korea Institute of Science and Technology
  • Korea Institute of Industrial Technology

External person

Bernd Tillack

  • IHP GmbH
  • IHP
  • Institut fur innovative Mikroelektronik (IHP)
  • IHP
  • Leibniz-Institut fur innovative Mikroelektronik
  • Innovations for High Performance Microelectronics

External person

L. H. Lu

  • University of Michigan, Ann Arbor
  • Univ of Michigan
  • NASA Lewis Research Center
  • NASA Glenn Research Center
  • Radiation Lab.
  • HRL Laboratories

External person

L. P.B. Katehi

  • Radiation Lab.
  • University of Michigan, Ann Arbor
  • IEEE
  • NASA Glenn Research Center
  • HRL Laboratories

External person

F. Pagette

  • M/S AE1
  • Semiconductor Res. and Devmt. Ctr.
  • IBM T. J. Watson Research Center
  • M/S EM1
  • IBM Semiconductor R and D Center
  • IBM Microelectronics Semiconductor Research and Development Center(SRDC)
  • IBM
  • IBM Microelectronics
  • IEEE
  • Global Foundries, Inc.
  • IBM Research

External person

In Sang Song

  • Korea Inst. of Sci. and Technol.
  • Samsung Advanced Institute of Technology
  • Samsung
  • Samsung Advanced Institute of Technology (SAIT)
  • Samsung Advanced Inst. of Technology
  • Samsung Adv. Institute of Technology
  • Samsung Adv. Inst. of Technol.
  • Samsung Advanced Institute of Technology
  • Korea Institute of Science and Technology
  • Korea University
  • Display and Nano-Devices Laboratory (L6320)
  • Future IT Center Communication Laboratory
  • Display and Nanosystem Laboratory, College of Engineering, Korea University
  • Research Institute of Engineering and Technology, College of Engineering, Korea University
  • Samsung Advanced Institute of Technologyy

External person

P. Smith

  • IBM
  • Global Foundries, Inc.
  • IBM Research

External person

Jea Shik Shin

  • School of Electrical Engineering, Korea University
  • School of Electrical and Engineering, Korea University
  • Korea University
  • Samsung Advanced Institute of Technology
  • Robotics Laboratory
  • Nanoelectronics Laboratory
  • School of Electrical, Engineering Korea University
  • Future IT Center Communication Laboratory
  • Advanced Device Laboratory

External person

H. Chen

  • IBM
  • Global Foundries, Inc.
  • IEEE
  • IBM Research

External person

Ping Chuan Wang

  • East Fishkill Facility
  • MS 862D
  • IBM Microelectronics
  • IBM Semiconductor R and D Center
  • IBM
  • IBM Microelectronics Division
  • Global Foundries, Inc.

External person

Guofu Niu

  • Auburn University
  • Department of Electrical Engineering
  • Electrical and Computer Engineering Department
  • Electrical and Computer Engineering Department

External person

Dough Coolbaugh

  • Global Foundries, Inc.
  • IBM

External person

Qingqing Liang

  • Georgia Institute of Technology
  • IBM Microelectronics
  • Georgia Tech.
  • IBM Microelectronics
  • Sch. of Elec./Computer Engineering
  • Global Foundries, Inc.

External person

Mounir Meghelli

  • IBM Research
  • T.J. Watson Research Center
  • IBM T. J. Watson Research Center
  • T. J. Watson Research Center
  • IBM
  • IEEE
  • Communications Research and Development Center (CRDC)
  • Global Foundries, Inc.

External person

Thomas Adam

  • IBM Microelectronics
  • M/S EM1
  • IBM Semiconductor R and D Center
  • M/S AE1
  • IBM
  • Global Foundries, Inc.

External person

Hyogi Seo

  • LG Electronics
  • LG Corporation
  • Korea University
  • School of Electrical Eng.
  • Optoelectronics Lab.
  • School of Electrical and Engineering, Korea University
  • Computer Network Lab.
  • Compiler and Microarchitecture Laboratory
  • Department of Electrical Engineering

External person

Robert Groves

  • IBM Microelectronics
  • IBM Microelectronics Division
  • East Fishkill Facility
  • IBM
  • IBM Microelectronics Semiconductor Research and Development Center(SRDC)
  • IBM
  • Communications Research and Development Center (CRDC)
  • Global Foundries, Inc.
  • IBM Research

External person

Ramkumar Krithivasan

  • Intel
  • Georgia Institute of Technology
  • Georgia Tech.

External person

Ho Soo Park

  • Samsung Advanced Institute of Technology (SAIT)
  • Samsung Advanced Institute of Technology
  • Samsung Advanced Inst. of Technology
  • Samsung Adv. Institute of Technology
  • Samsung Adv. Inst. of Technol.
  • Samsung Advanced Institute of Technology

External person

Chul Soo Kim

  • Samsung Advanced Institute of Technology

External person

Stephen St. Onge

  • IBM Microelectronics Division
  • Burlington Facility
  • IBM
  • IBM
  • IBM Microelectronics Division
  • Global Foundries, Inc.

External person

Yuan Lu

  • Georgia Institute of Technology
  • Georgia Tech.

External person

Myeong Gyo Seo

  • Korea University
  • Robotics Laboratory
  • School of Electrical Engineering, Korea University
  • Nanoelectronics Laboratory
  • School of Electrical, Engineering Korea University

External person

Young Chai Jung

  • Korea University
  • School of Electrical Eng.
  • Compiler and Microarchitecture Laboratory
  • School of Electrical and Engineering, Korea University
  • Power Quality Technology

External person

Duck Hwan Kim

  • Samsung Advanced Institute of Technology (SAIT)
  • Samsung Advanced Institute of Technology
  • Samsung Advanced Inst. of Technology
  • Samsung Adv. Institute of Technology
  • Samsung Adv. Inst. of Technol.
  • Samsung Advanced Institute of Technology

External person

Seungyong Lee

  • LG Electronics
  • Korea University
  • LG Electronics
  • LG Corporation
  • Optoelectronics Lab.
  • Compiler and Microarchitecture Laboratory
  • School of Electrical Eng.
  • LG Electronics
  • Computer Network Lab.
  • Power Quality Technology
  • School of Electrical and Engineering, Korea University
  • Department of Electrical Engineering

External person

Richard Volant

  • IBM Microelectronics
  • IBM Microelectronics Division
  • IBM
  • M/S AE1
  • IBM
  • Communications Research and Development Center (CRDC)
  • Global Foundries, Inc.

External person

C. Schnabel

  • M/S AE1
  • M/S EM1
  • IBM Semiconductor R and D Center
  • IBM Microelectronics Semiconductor Research and Development Center(SRDC)
  • IBM
  • Global Foundries, Inc.
  • IBM Research

External person

D. Kim

  • Sungkyunkwan University
  • Korea University

External person

Sang Uk Son

  • Samsung Advanced Institute of Technology

External person

B. Orner

  • IBM
  • Global Foundries, Inc.

External person

George E. Ponchak

  • IEEE
  • NASA Glenn Research Center
  • Univ of Michigan
  • NASA Lewis Research Center
  • University of Michigan, Ann Arbor
  • European Microwave Association
  • Radiation Lab.
  • HRL Laboratories

External person

Moon Chul Lee

  • Samsung Advanced Institute of Technology (SAIT)
  • Samsung Advanced Institute of Technology
  • Samsung Advanced Inst. of Technology
  • Samsung Adv. Institute of Technology
  • Samsung Adv. Inst. of Technol.
  • Samsung Advanced Institute of Technology

External person

O. Qasaimeh

  • University of Michigan, Ann Arbor
  • Univ of Michigan
  • Radiation Lab.

External person

Samuel A. Alterovitz

  • IEEE
  • NASA Lewis Research Center
  • Univ of Michigan
  • University of Michigan, Ann Arbor
  • NASA Glenn Research Center
  • Radiation Lab.
  • HRL Laboratories

External person

D. Angell

  • Global Foundries, Inc.
  • IBM
  • IBM Research

External person

Yujie Ai

  • Samsung Advanced Institute of Technology (SAIT)
  • Samsung Advanced Institute of Technology
  • Samsung Adv. Institute of Technology
  • Samsung Adv. Inst. of Technol.
  • Samsung Advanced Institute of Technology

External person

K. H. Yeo

  • Samsung
  • Semiconductor R and D Center, Samsung Electronics Co., Ltd.
  • Advanced Technology Development Team 1

External person

Jing Cui

  • Samsung Advanced Institute of Technology (SAIT)
  • Samsung Advanced Institute of Technology
  • Samsung Adv. Institute of Technology
  • Samsung Adv. Inst. of Technol.
  • Samsung Advanced Institute of Technology

External person

K. Watson

  • IBM Microelectronics
  • IBM Semiconductor R and D Center
  • IBM
  • Global Foundries, Inc.

External person

K. Yang

  • University of Michigan, Ann Arbor
  • Univ of Michigan
  • Radiation Lab.

External person

Qizhi Liu

  • IBM Microelectronics
  • IBM Microelectronics Division
  • IBM
  • IBM
  • Semiconductor Res. and Devmt. Ctr.
  • Global Foundries, Inc.

External person

Dong Hyun Kim

  • Korea University
  • Compiler and Microarchitecture Laboratory, School of Electrical and Computer Engineering, Korea University
  • School of Electrical Eng.
  • ?Gangneung-Wonju National University
  • Kyungpook National University

External person

Dong Won Kim

  • Chungbuk National University
  • Samsung
  • Kyonggi University
  • Chunghuk National University
  • College of Natural Sciences, Chungbuk National University
  • Konyang University
  • Kiheung Plant
  • Korea University
  • Optoelectronics Lab.
  • Department of Advanced Materials Engineering
  • Semiconductor R and D Center, Samsung Electronics Co., Ltd.
  • Memory Division
  • Advanced Technology Development Team 1
  • Robotics Laboratory
  • Memory Division, Samsung Electronics
  • School of Electrical Engineering, Korea University
  • Nanoelectronics Laboratory
  • Department of Electrical Engineering
  • School of Electrical, Engineering Korea University
  • Inha Technical College
  • Sangmyung University

External person

R. Krishnasamy

  • IBM Semiconductor R and D Center
  • IBM Microelectronics
  • IBM
  • Global Foundries, Inc.

External person

Yan Zhao

  • Alcatera Inc.
  • University of California at Los Angeles

External person

Keun Hwi Cho

  • Samsung
  • Semiconductor R and D Center, Samsung Electronics Co., Ltd.
  • Advanced Technology Development Team 1

External person

Zhengqiang Ma

  • University of Michigan, Ann Arbor
  • Radiation Lab.
  • IEEE

External person

Jonathan B. Hacker

  • Rockwell Science Center
  • Univ of Technol, Gothenborg, Sweden
  • Teledyne Scientific Company
  • Gold Star
  • Rockwell Scientific Company
  • Rockwell Scientific
  • California Inst of Technology
  • Bell Communications Research
  • Pasadena, CA, USA
  • Rockwell Int - Science Cent
  • Rockwell International Science Center
  • Teledyne Scientific and Imaging
  • Teledyne Technologies
  • Chalmers University of Technology
  • California Institute of Technology
  • Telcordia Technologies
  • LG Corporation
  • Bell Communications Reaearch
  • Division of Engineering and Applied Science
  • Division of Engineering and Applied Science
  • IEEE
  • Dept of Appl Electron Phys, Chalmers
  • Department of Electrical Engineering
  • Division of Engineering and Applied Science
  • Rockwell Collins
  • Teledyne Technologies

External person

K. K. Linder

  • University of Michigan, Ann Arbor
  • Radiation Laboratory
  • Radiation Lab.
  • University of Michigan

External person

J. Florkey

  • M/S AE1
  • IBM Semiconductor R and D Center
  • IBM Microelectronics Semiconductor Research and Development Center(SRDC)
  • IBM
  • Global Foundries, Inc.
  • IBM Research

External person

A. Chinthakindi

  • M/S AE1
  • M/S EM1
  • IBM Semiconductor R and D Center
  • IBM
  • Global Foundries, Inc.

External person

Seungwoo Seo

  • Compiler and Microarchitecture Laboratory
  • Korea University
  • Korean Agency for Defense Development

External person

Jarle Johansen

  • University of Tromso
  • University of Tromsø
  • University of Tromsø – The Arctic University of Norway
  • Georgia Institute of Technology
  • Institute of Physics
  • School of Electrical and Computer Engineering

External person

D. I. Sanderson

  • SRDC
  • M/S EM1
  • IBM Semiconductor R and D Center
  • IBM
  • Global Foundries, Inc.

External person

B. H. Hong

  • Korea University
  • School of Electrical Eng.
  • Compiler and Microarchitecture Laboratory

External person

Richard Al Hadi

  • Alcatera Inc.
  • École de technologie supérieure
  • University of California at Los Angeles

External person

Kevin Brelsford

  • IBM Microelectronics
  • MS 862D
  • IBM
  • Communications Research and Development Center (CRDC)
  • Global Foundries, Inc.

External person

Dongmok Whang

  • Sungkyunkwan University
  • School of Advanced Materials Science and Engineering, Sungkyunkwan University, Advanced Institute Nanotechnology
  • Samsung Advanced Institute of Technology
  • School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU)
  • Research Center for Time-domain Nano-functional Devices
  • Department of Advanced Materials Science and Engineering
  • Research Center for Time-Domain and Nano-Functional Devices
  • Korea University
  • Research Center for Time-Domain Nano-Functional Device, Samsung Advanced Institute of Technology
  • Research Center for Time Domain Nano-functional Devices
  • School of Materials Science and Engineering

External person

Jungsoo Kim

  • School of Electrical Engineering, Korea University Seoul
  • School of Electrical Engineering, Korea University
  • Korea University
  • Robotics Laboratory
  • School of Electrical Engineering, Korea University
  • Nanoelectronics Laboratory
  • School of Electrical, Engineering Korea University

External person

H. J. Park

  • Korea University
  • School of Electrical Eng.
  • School of Electrical and Engineering, Korea University
  • Compiler and Microarchitecture Laboratory
  • Dongbu-Anam Semiconductor Inc.

External person

Jai Heon Cho

  • School of Electrical Engineering, Korea University
  • Korea University
  • School of Electrical, Engineering Korea University
  • Samsung

External person

Zhenrong Jin

  • Georgia Institute of Technology
  • Sch. of Elec./Computer Engineering
  • School of Electrical and Computer Engineering

External person

Hyungcheol Shin

  • Seoul National University
  • Department of Electrical Engineering and Computer Science

External person

Y. S. Yu

  • Hankyong National University
  • NBARC, Hankyong National University
  • Korea University
  • Department of Electrical, Electronic and Control Engineering and IITC
  • Department of Information and Control Engineering
  • School of Electrical Eng.
  • Optoelectronics Lab.
  • Department of Electrical, Electronic and Control Engineering, Hankyong National University
  • Compiler and Microarchitecture Laboratory
  • Power Quality Technology
  • Department of Electrical Engineering
  • IITC

External person

F. C. Zhang

  • University of Michigan, Ann Arbor
  • Radiation Laboratory

External person

K. Vaed

  • M/S AE1
  • IBM Semiconductor R and D Center
  • IBM
  • Global Foundries, Inc.

External person

Yan Cui

  • Auburn University
  • Department of Electrical Engineering

External person

Won Seong Lee

  • Samsung
  • Advanced Technology Development Team 1

External person

Dean Herman

  • IBM Microelectronics
  • IBM
  • Communications Research and Development Center (CRDC)
  • Global Foundries, Inc.

External person

Sang Hun Song

  • Chung-Ang University
  • School of Electrical and Electronics Engineering
  • Sch. of Elec. and Electron. Eng.
  • Department of Electrical Engineering
  • IEEE

External person

Sungjin Kim

  • Korea University

External person

Wooyong Keum

  • Korea University

External person

Alexander Rylyakov

  • IBM T. J. Watson Research Center
  • T. J. Watson Research Center
  • IBM
  • IEEE

External person

Luryi Choi

  • Korea University
  • School of Electrical Eng.
  • Compiler and Microarchitecture Laboratory
  • School of Electrical and Engineering, Korea University
  • Power Quality Technology

External person

Bernard Meyerson

  • IBM
  • IBM Research
  • Communications Research and Development Center (CRDC)
  • Global Foundries, Inc.

External person

D. Klotzkin

  • University of Michigan, Ann Arbor
  • Univ of Michigan
  • Radiation Lab.

External person

M. Urteaga

  • Teledyne Scientific Company
  • Teledyne Technologies
  • Teledyne Scientific Company
  • Teledyne Scientific Company
  • Teledyne Technologies

External person

F. Golan

  • M/S AE1
  • IBM Microelectronics Semiconductor Research and Development Center(SRDC)
  • IBM
  • Global Foundries, Inc.
  • IBM Research

External person

Vidhya Ramachandran

  • Global Foundries, Inc.
  • IBM

External person

A. Ahmed

  • Georgia Institute of Technology

External person

G. Y. Jin

  • Samsung
  • Semiconductor R and D Center, Samsung Electronics Co., Ltd.

External person

D. H. Lee

  • Korea University
  • MClavis Co., Ltd

External person

Dawn Wang

  • TriQuint Semiconductor
  • IBM
  • IBM
  • Qorvo

External person

Chan Hyeong Park

  • Kwangwoon University
  • Department of Electronics and Communications Engineering
  • Electronics and Communications Engineering

External person

Donggun Park

  • Samsung
  • Semiconductor R and D Center, Samsung Electronics Co., Ltd.
  • Advanced Technology Development Team 1

External person

Peter Cottrell

  • IBM Semiconduct. Res./Devmt. Ctr.
  • IBM
  • IBM Research

External person

Seung Jae Oh

  • Yonsei University
  • University of Seoul
  • Korea University
  • Department of Physiology
  • Brain Korea 21 Project for Medicine
  • Department of Radiology
  • Department of Radiology, College of Medicine, Yonsei University
  • YUHS-KRIBB Medical Convergence Research Institute
  • Yonsei Integrative Research Institute for Cerebral and Cardiovascular Diseases (YIRIC)
  • Korea Research Institute of Bioscience and Biotechnology
  • Pohang University of Science and Technology

External person

L. Lanzerotti

  • IBM Microelectronics Division
  • Burlington Facility
  • IBM
  • IBM Microelectronics
  • IBM Microelectronics Division
  • Semiconductor Res. and Devmt. Ctr.
  • Global Foundries, Inc.

External person

J. O. Plouchart

  • SRDC
  • IBM T. J. Watson Research Center
  • IBM
  • Global Foundries, Inc.

External person

Michael J. Zierak

  • Burlington Facility
  • IBM
  • IBM
  • IBM Microelectronics Division
  • Global Foundries, Inc.

External person

Ebenezer Eshun

  • IBM Microelectronics Division
  • IBM
  • IBM
  • Global Foundries, Inc.

External person

D. H. Hwang

  • Samsung Advanced Institute of Technology
  • Research Center for Time-domain Nano-functional Devices
  • Korea University
  • School of Electrical Eng.
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Research Center for Time-Domain Nano-Functional Device, Samsung Advanced Institute of Technology

External person

George E. Ponchak

  • NASA Glenn Research Center

External person

Steven Zier

  • IBM Microelectronics
  • IBM
  • IEEE
  • Global Foundries, Inc.

External person

Hyunji Koo

  • Korea Research Institute of Standards and Science

External person

R. Malik

  • Department of Chemical Engineering
  • University of Michigan, Ann Arbor

External person

Christine Norris

  • IBM Semiconductor Research and Development Center
  • IBM
  • Systems and Technology Group
  • IBM Research

External person

Kab Jin Kim

  • Seoul National University
  • Kyoto University
  • Korea Advanced Institute of Science and Technology
  • Department of Physics, KAIST
  • Institute for Chemical Research
  • School of Physics

External person

Yeocho Yoon

  • Dongbu Hitek
  • Dongbu HiTeK

External person

Jaeman Lee

  • Korea University

External person

P. Cottrel

  • MS 863C
  • IBM

External person

Young Kwark

  • T. J. Watson Research Center
  • IBM
  • IEEE

External person

Bo Yeon Hwang

  • Department of Electrical Engineering, Korea University
  • Computer Network Lab.
  • Korea University
  • Korea Institute of Machinery and Materials
  • Robotics Laboratory
  • Nanomechanical Systems Research Division
  • School of Electrical Engineering
  • Department of Electronic Engineering
  • Display and Nanosystem Laboratory, College of Engineering, Korea University
  • School of Electrical Eng.
  • School of Electrical Engineering, Korea University
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Nanoelectronics Laboratory
  • School of Electrical, Engineering Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • Research Institute of Engineering and Technology, College of Engineering, Korea University

External person

Robert A. Reed

  • NASA-GSFC
  • NASA Goddard Space Flight Center

External person

Ickhyun Song

  • Seoul National University

External person

Todd Tanji

  • Sagesse Technologies, Inc.
  • IEEE

External person

Kyungmin Kim

  • Korea Institute of Energy Research
  • Korea University

External person

Seungwoo Seo

  • Korea University

External person

Ed Hostetter

  • IBM Microelectronics
  • IBM
  • Semiconductor Res. and Devmt. Ctr.
  • Global Foundries, Inc.

External person

Natalie B. Feilchenfeld

  • Burlington Facility
  • IBM
  • IBM Microelectronics Division
  • Global Foundries, Inc.

External person

Mahender Kumar

  • IBM
  • IBM Research

External person

Maeng Ho Son

  • University of Seoul
  • Korea Inst. of Sci. and Technology
  • Korea Institute of Science and Technology
  • Institute of Quantum Information Processing and Systems
  • Semiconductor Materials Laboratory

External person

Yuna Choi

  • Department of Radiology, College of Medicine, Yonsei University
  • Yonsei University

External person

Carl Dickey

  • IBM Microelectronics
  • IBM
  • Communications Research and Development Center (CRDC)
  • Global Foundries, Inc.

External person

Gyusung Kang

  • Korea University

External person

Hokyu Lee

  • Electrical Engineering, Korea University
  • Korea University
  • Dept. of Elect. Eng.
  • Advanced Integrated Systems Lab.
  • Compiler and Microarchitecture Laboratory, School of Electrical and Computer Engineering, Korea University
  • Computer Network Lab.
  • Electrical and Electronics Engineering Department
  • Department of Electronic Engineering
  • Department of Electronics and Electrical Engineering, Korea University
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Electrical and Computer Engineering, Korea University
  • Department of Electrical Engineering, Institute for Nano Science, Korea University

External person

J. Pekarik

  • SRDC
  • IBM
  • Global Foundries, Inc.

External person

C. Willets

  • IBM
  • IBM
  • Global Foundries, Inc.

External person

J. I. Lee

  • Korea University
  • Compiler and Microarchitecture Laboratory
  • Power Quality Technology

External person

Jin Cai

  • IBM T. J. Watson Research Center
  • IBM

External person

M. Crites

  • Radiation Lab.
  • University of Michigan, Ann Arbor

External person

K. J. Lee

  • Korea University
  • School of Electrical Eng.
  • Compiler and Microarchitecture Laboratory
  • Robotics Laboratory
  • Power Quality Technology
  • School of Electrical and Engineering, Korea University
  • School of Electrical Engineering, Korea University
  • Nanoelectronics Laboratory
  • LIG Nex1 Co.

External person

Mau Chung Frank Chang

  • University of California at Los Angeles

External person

Seung Yong Cha

  • Korea University
  • Compiler and Microarchitecture Laboratory
  • Power Quality Technology

External person

R. Lin

  • Jet Propulsion Laboratory, California Institute of Technology

External person

Kyung Min Kim

  • Korea University
  • Avago Technology

External person

S. Furkay

  • IBM Microelectronics
  • IBM
  • Global Foundries, Inc.

External person

Hyunchul Kim

  • Korea University

External person

Ying Li

  • Auburn University
  • Electrical and Computer Engineering Department

External person

Se Jin Park

  • Korea Institute of Science and Technology
  • Department of Chemical and Biological Engineering, Korea University
  • Clean Energy Center
  • Korea University
  • Department of Material and Science and Engineering, Korea University
  • Clean Energy Research Centre, Korea Institute of Science and Technology
  • Department of Chemical and Biological Engineering, College of Engineering, Korea University
  • Center of Fuel Cell Research
  • Department of Electronic Engineering
  • Fuel Cell Center
  • Computer Network Research Lab, Department of Electronics Engineering, Korea University
  • Department of Material Science and Engineering
  • Graduate School of Information Security, Korea University
  • Department of Materials Science and Engineering, Korea University Anam
  • Dept. of Chemical and Biological Engineering, Korea University
  • Graduate School of Information Security, CIST, Korea University 1
  • Department of Electrical Engineering, Institute for Nano Science, Korea University
  • University of Texas at Austin
  • Hallym University

External person

K. S. Oh

  • Samsung
  • Semiconductor R and D Center, Samsung Electronics Co., Ltd.

External person

Vidhya Ramachandran

  • IBM Microelectronics Division
  • IBM
  • MS 863C
  • IBM
  • Global Foundries, Inc.

External person

Jong Guk Choi

  • Korea Advanced Institute of Science and Technology
  • Department of Materials Science and Engineering and KI for Nanocentury

External person

Ragad Al-Huq

  • Georgia Institute of Technology
  • Sch. of Elec./Computer Engineering

External person

B. Rainey

  • Global Foundries, Inc.

External person

K. Yang

  • University of Michigan, Ann Arbor

External person

S. J. Lee

  • Compiler and Microarchitecture Laboratory
  • Korea University

External person

Ju Hwan Lim

  • Korea University

External person

Yong Min Huh

  • Yonsei University
  • Severance Biomedical Science Institute(SBSI)
  • YUHS-KRIBB Medical Convergence Research Institute
  • Department of Radiology, College of Medicine, Yonsei University
  • YUHS, KRIBB, Medical Convergence Research Institute
  • Severance Biomedical Science Institute (SBSI)
  • Department of Radiology
  • Graduate Program for Nanomedical Science
  • Department of Radiology
  • College of Medicine
  • Department of Radiology
  • YUHS-KRIBB Medical Convergence Research Institute
  • Department of Radiology
  • Department of Biochemistry and Molecular Biology
  • Brain Korea 21 Plus Project for Medical Science
  • YUHS-KRIBB Medical Convergence Research Institute
  • Brain Korea 21 Project for Medical Science
  • Korea Research Institute of Bioscience and Biotechnology

External person

James Mecke

  • IBM Microelectronics
  • IBM
  • Communications Research and Development Center (CRDC)
  • Global Foundries, Inc.

External person

Jonghae Kim

  • IBM Semiconductor Research and Development Center
  • IBM
  • Systems and Technology Group
  • IBM Research

External person

H. T. Kim

  • Korea University

External person

D. H. Kwon

  • SK Hynix Inc
  • Korea University
  • Computer Network Lab.
  • School of Electrical Eng.
  • Compiler and Microarchitecture Laboratory
  • Power Quality Technology
  • Electrical and Computer Engineering, Korea University
  • SK Hynix Inc.
  • SK Corporation

External person

Younga Cho

  • Korea University
  • Compiler and Microarchitecture Laboratory, School of Electrical and Computer Engineering, Korea University

External person

Sungjae Lee

  • IBM
  • IBM Research

External person

Omeed Momeni

  • University of California at Davis

External person

Oswin M. Schreiber

  • Applied Micro Circuits Corporation
  • IEEE

External person

Samuel A. Alterovitz

  • NASA Glenn Research Center

External person

K. H. Kim

  • Korea University
  • Computer Network Lab.
  • Robotics Laboratory
  • IEEE
  • Dept. of Mechanical Eng.
  • School of Electrical Eng.
  • Optoelectronics Lab.
  • Compiler and Microarchitecture Laboratory
  • School of Electrical Engineering, Korea University
  • Power Quality Technology
  • Nanoelectronics Laboratory
  • Electrical and Computer Engineering, Korea University
  • School of Electrical, Engineering Korea University
  • Department of Electrical Engineering

External person

Iljin Lee

  • School of Electrical Engineering, Korea University
  • School of Electrical Engineering, Korea University Seoul
  • Korea University
  • Robotics Laboratory
  • Nanoelectronics Laboratory
  • School of Electrical, Engineering Korea University
  • Samsung

External person

Wei Min Lance Kuo

  • Georgia Institute of Technology

External person

Bernd Heinemann

  • IHP GmbH
  • Institut fur innovative Mikroelektronik (IHP)
  • Innovations for High Performance Microelectronics

External person

W. Hodge

  • IBM
  • IBM
  • Global Foundries, Inc.

External person

Steven H. Voldman

  • Burlington Facility
  • IBM
  • IBM Microelectronics Division
  • Global Foundries, Inc.

External person

X. Liu

  • Global Foundries, Inc.

External person

D. Collins

  • Global Foundries, Inc.

External person

Chendong Zhu

  • Georgia Institute of Technology
  • Sch. of Elec./Computer Engineering

External person

E. Gulari

  • University of Michigan, Ann Arbor
  • Department of Chemical Engineering

External person

Byong Guk Park

  • Korea Advanced Institute of Science and Technology
  • Materials Science and Engineering and KI for Nanocentury, KAIST
  • Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
  • Department of Materials Science and Engineering and KI for Nanocentury

External person

M. G. Kang

  • University of Seoul
  • Korea University
  • Compiler and Microarchitecture Laboratory
  • Institute of Quantum Information Processing and Systems
  • School of Electrical Eng.
  • Research Center for Time-Domain and Nano-Functional Devices
  • Department of Material Science and Engineering
  • Power Quality Technology
  • School of Electrical and Engineering, Korea University
  • Department of Materials Science and Enginnering
  • Department of Electrical Engineering, Institute for Nano Science, Korea University

External person

Tianbing Chen

  • Georgia Institute of Technology
  • Sch. of Elec./Computer Engineering

External person

Lei Zhu

  • Nanyang Technological University
  • IEEE
  • School of Electrical and Electronic Engineering
  • Sch. of Elec. and Electron. Eng.
  • Sch. of Elec./Electronic Engineering

External person

Songcheol Hong

  • Korea Advanced Institute of Science and Technology

External person

Surajit Kumar Nath

  • National Yang Ming Chiao Tung University

External person

Michael A. Sorna

  • IBM Microelectronics
  • IBM
  • IEEE
  • Global Foundries, Inc.

External person

Jae Hyun Ahn

  • Korea University

External person

S. Sweeney

  • IBM Semiconductor R and D Center
  • IBM

External person

Sungmook Lim

  • Korea Advanced Institute of Science and Technology

External person

N. Cho

  • Korea University

External person

Becca M. Haugerud

  • Georgia Institute of Technology

External person

Gihyun Lim

  • Korea University

External person

Akil K. Sutton

  • Georgia Institute of Technology

External person

Y. M. Lee

  • Korea University

External person

E. Mengistu

  • IBM
  • IBM Research

External person

J. F. Whitaker

  • Radiation Lab.
  • University of Michigan, Ann Arbor

External person

A. Skalare

  • Jet Propulsion Laboratory, California Institute of Technology

External person

Imran Mehdi

  • University of Michigan, Ann Arbor
  • Jet Propulsion Laboratory, California Institute of Technology

External person

D. Sheridan

  • IBM Microelectronics Division
  • IBM
  • IBM Microelectronics
  • Semiconductor Res. and Devmt. Ctr.
  • Global Foundries, Inc.

External person

Jae Choon Kim

  • Korea University
  • System LSI Division

External person

Joon Goo Lee

  • Korea University
  • Computer Network Lab.
  • Compiler and Microarchitecture Laboratory, School of Electrical and Computer Engineering, Korea University
  • Compiler and Microarchitecture Laboratory
  • School of Electrical Eng.
  • Power Quality Technology
  • School of Electrical and Engineering, Korea University
  • Compiler and Advanced Computer Systems Laboratory
  • Electrical and Computer Engineering, Korea University

External person

G. David

  • Radiation Lab.
  • University of Michigan, Ann Arbor

External person

Y. Y. Yeoh

  • Samsung
  • Advanced Technology Development Team 1

External person

Kihan Kim

  • Korea University
  • Compiler and Microarchitecture Laboratory
  • Power Quality Technology

External person

Lawrence Larson

  • University of California at San Diego
  • Communications Research and Development Center (CRDC)
  • IBM
  • Global Foundries, Inc.

External person

P. Geiss

  • IBM
  • IBM
  • Global Foundries, Inc.

External person

Choongyeun Cho

  • IBM Semiconductor Research and Development Center
  • IBM
  • Systems and Technology Group
  • IBM Research

External person

Choul Young Kim

  • Chungnam National University
  • Samsung

External person

M. Gordon

  • Global Foundries, Inc.

External person

Gyoungbum Kim

  • Korea University
  • Optoelectronics Lab.
  • Compiler and Microarchitecture Laboratory
  • Computer Network Lab.
  • Power Quality Technology
  • Department of Electrical Engineering

External person

Ullich Pfeiffer

  • University of Wuppertal

External person

Zhenqiang Ma

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • Department of Electrical and Computer Engineering
  • University of Wisconsin

External person

Peter Bacon

  • RFIC Design Center
  • IBM
  • Communications Research and Development Center (CRDC)
  • IBM Microelectronics
  • Global Foundries, Inc.

External person

S. D. Suk

  • Samsung
  • Advanced Technology Development Team 1

External person

Tushar Thrivikraman

  • Georgia Institute of Technology

External person

Hye Young Son

  • Department of Radiology, College of Medicine, Yonsei University
  • Yonsei University

External person

F. Anderson

  • MS 863C
  • IBM

External person

D. Ahn

  • University of Seoul
  • Univ. Seoul, Jeonnong-dong, D.
  • Korea University
  • Department of Electrical and Computer Engineering
  • Institute of Quantum Information Processing and Systems
  • Optoelectronics Lab.
  • Department of Electrical Engineering

External person

Xuefeng Liu

  • University of Michigan, Ann Arbor

External person

Seungyoon Jung

  • Korea University
  • Robotics Laboratory
  • School of Electrical Engineering, Korea University
  • Nanoelectronics Laboratory
  • School of Electrical, Engineering Korea University

External person

Sangwoo Yoon

  • Korea University

External person

M. Li

  • Samsung
  • Advanced Technology Development Team 1

External person

Sung Min Hong

  • Bundeswehr University
  • Korea Electronics Technology Institute
  • Universität der Bundeswehr München

External person

Paul W. Marshall

  • NASA-GSFC
  • NASA Goddard Space Flight Center

External person

Mehmet Soyuer

  • IBM Research
  • Communications Research and Development Center (CRDC)
  • IBM
  • Global Foundries, Inc.

External person

Minje Cho

  • Korea University

External person

Herman Jalli Ng

  • University of Applied Sciences Karlsruhe

External person

A. Jeseph

  • IBM Microelectronics
  • IBM
  • Global Foundries, Inc.

External person

Eun Kyung Hyun

  • Korea University
  • Div. of Mat. Science and Engineering
  • Department of Material Science and Engineering
  • Div. of Materials Science and Eng.
  • Department of Materials Science and Enginnering

External person

Min Gu Kang

  • Korea Advanced Institute of Science and Technology

External person

Keith Walter

  • IBM Microelectronics
  • IBM
  • IEEE
  • Global Foundries, Inc.

External person

Jaehyeon Park

  • Korea Advanced Institute of Science and Technology

External person

K. Rim

  • IBM
  • IBM

External person

Shlomo Pinhas

  • Kinneret Academic College

External person

Jeongkyu Heo

  • Korea University
  • Compiler and Microarchitecture Laboratory
  • Power Quality Technology

External person

Jongwoon Lee

  • Sungkyunkwan University
  • Research Center for Time-Domain and Nano-Functional Devices
  • School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU)
  • Korea University
  • School of Advanced Materials Science and Engineering, Sungkyunkwan University, Advanced Institute Nanotechnology

External person

P. Gray

  • IBM
  • IBM
  • Global Foundries, Inc.

External person

Daeik Kim

  • IBM
  • IBM Research

External person

Yoonsuk Choi

  • Korea University
  • Compiler and Microarchitecture Laboratory
  • Power Quality Technology

External person

Y. Li

  • Auburn University

External person

D. Houghton

  • National Research Council of Canada
  • SiGe Microsystems, Inc.
  • National Research Council of Canada
  • SiGe Microsystems Inc.
  • Institute for Microstructural Sciences

External person

Robert Trzcinski

  • IBM Semiconductor Research and Development Center
  • IBM
  • Systems and Technology Group
  • IBM Research

External person

B. Jagannathan

  • SRDC
  • IBM
  • Global Foundries, Inc.

External person

Jiahui Yuan

  • Georgia Institute of Technology

External person

Mattias E. Dahlstrom

  • IBM Microelectronics
  • IBM
  • Global Foundries, Inc.

External person

Tae Hyun Oh

  • Seoul National University

External person