Material Science
Thin Films
100%
Solder Joint
79%
Film
77%
Cubic Boron Nitride
64%
Intermetallics
64%
Oxidation Reaction
62%
Crystallite
61%
Solar Cell
59%
Silicon
55%
Crystalline Material
52%
Oxide Compound
45%
Nanoparticle
43%
Contact Resistance
43%
Silver
43%
Thick Films
40%
Powder
39%
Boron
38%
Steel Sheet
32%
Residual Stress
31%
Boron Nitride
30%
Density
28%
Creep
26%
Morphology
25%
Amorphous Material
24%
Hydrogenation
24%
Proton Irradiation
21%
Wettability
21%
Silicon Wafer
21%
Corrosion Resistance
21%
Anisotropy
21%
Silicon Nitride
21%
Ferritic Stainless Steel
21%
Magnetic Property
21%
Magnetic Composite
21%
Crystalline Silicon Solar Cell
21%
Thermoelectrics
21%
Aluminum Alloys
21%
Silver Ion
19%
Electrical Resistivity
18%
Annealing
16%
Surface Stress
16%
Lattice Constant
16%
Magnetron Sputtering
16%
Transmission Electron Microscopy
15%
Thermoelectric Materials
14%
Silicon Solar Cell
14%
Microstructural Evolution
13%
Aluminum Oxide
13%
Creep Property
13%
Point Defect
13%
Engineering
Microstructure
66%
Thin Films
64%
Cubic Boron Nitride
43%
Layer Coating
32%
Growth Kinetics
30%
Supersaturation
26%
Nanoparticle
23%
Solar Cell
21%
Interconnects
21%
Corrosion Resistance
21%
Ferritic Stainless Steel
21%
Solid Oxide Fuel Cell
21%
Diffusion Couple
21%
Residual Stress
17%
Crystallite
16%
Silver Ion
16%
Silicon Layer
16%
Coherency Stress
16%
Coherency
16%
Retardation
16%
Transmissions
14%
Magnetron
14%
Thermal Oxidation
14%
Layer Thickness
14%
Elastic Stress
14%
Thermodynamic Model
14%
Inkjet Printing
14%
Nitride Layer
14%
Deposited Film
13%
Room Temperature
13%
Firing Process
13%
Aluminum Oxide
12%
Bias Voltage
12%
Si Wafer
12%
Nitride
11%
CO2 Conversion
10%
Sputter Target
10%
Induced Residual Stress
10%
Silicon Wafer
10%
Creep
10%
Radio Frequency
10%
Intermetallics
10%
Cu Surface
10%
Electrical Performance
10%
Blue Light
10%
Thermodynamic Stability
10%
Oxide Scale
10%
Microstructure Evolution
10%
Durables
10%
Intermediate Phase
10%
Keyphrases
Cubic Boron Nitride Film
28%
Residual Stress Reduction
25%
Turbostratic Boron Nitride
25%
Sn-3.5Ag Solder
21%
Thick Film Contacts
21%
Evolution Path
21%
Kinetic Barrier
21%
Crystalline Silicon Solar Cell
21%
Silicon Layer
21%
Nitrided Layer
21%
Supersaturation
21%
Cubic Boron Nitride (c-BN)
19%
BN Layer
18%
Growth Kinetics
17%
Coherency Stress
15%
Thermodynamic Model
14%
Buried Oxide
14%
Thermodynamics
14%
Thermal Oxidation
14%
Nitride Films
12%
Cu Substrate
12%
Cu6Sn5
12%
Float-zone Silicon
10%
Induced Junction
10%
Area Specific Resistance
10%
Solid Oxide Fuel Cell Interconnects
10%
Palladium Layer
10%
Extended Thermodynamics
10%
Massive Spalling
10%
Ag Crystallites
10%
Cu Diffusion
10%
Satellite Droplet
10%
Double-insulating Layer
10%
Aluminum Particles
10%
Electrohydrodynamic Inkjet
10%
Etch-stop
10%
Mg2FeH6
10%
Gate Stack
10%
Cold Roll
10%
Room-temperature Hydrogenation
10%
Compound Growth
10%
Ni-Sn
10%
Solid-state Interaction
10%
Effect of Oxygen Partial Pressure
10%
Oxygen-containing Atmosphere
10%
Film Diffusion
10%
Non-native Substrate
10%
Contact Firing
10%
Al Coating
10%
Oxygen Influence
10%
