17.6 Conversion efficiency multicrystalline silicon solar cells using the reactive ion etching with the damage removal etching

Ji Myung Shim, Hyun Woo Lee, Kyeong Yeon Cho, Jae Keun Seo, Ji Soo Kim, Eun Joo Lee, Jun Young Choi, Dong Joon Oh, Jeong Eun Shin, Ji Sun Kim, Ji Hyun Kong, Soo Hong Lee, Hae Seok Lee

Research output: Contribution to journalArticlepeer-review

15 Citations (Scopus)

Abstract

For lower reflectance, we applied a maskless plasma texturing technique using reactive ion etching (RIE) on acidic-textured multicrystalline silicon (mc-Si) wafer. RIE texturing had a deep and narrow textured surface and showed excellent low reflectance. Due to plasma-induced damage, unless the RIE-textured surfaces have the proper damage removal etching (DRE), they have a drop in Vocand FF. RIE texturing with a proper DRE had sufficiently higher short circuit current (I sc) than acidic-textured samples without a drop in open circuit voltage (Voc). And in order to improve efficiency of mc-Si solar cell, we applied RIE texturing with optimized DRE condition to selective emitter structure. In comparison with the acidic-textured solar cells, RIE-textured solar cells have above 200mA absolute gain in Isc. And optimized RIE samples with a DRE by HNO3/HF mixture showed 17.6% conversion efficiency, which were made using an industrial screen printing process with selective emitter structure.

Original languageEnglish
Article number248182
JournalInternational Journal of Photoenergy
Volume2012
DOIs
Publication statusPublished - 2012
Externally publishedYes

ASJC Scopus subject areas

  • Chemistry(all)
  • Atomic and Molecular Physics, and Optics
  • Renewable Energy, Sustainability and the Environment
  • Materials Science(all)

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