TY - GEN
T1 - 23.3 A 3-bit/2UI 27Gb/s PAM-3 Single-Ended Transceiver Using One-Tap DFE for Next-Generation Memory Interface
AU - Park, Hyunsu
AU - Song, Junyoung
AU - Lee, Yeonho
AU - Sim, Jincheol
AU - Choi, Jonghyuck
AU - Kim, Chulwoo
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/3/6
Y1 - 2019/3/6
N2 - Bandwidths of memory interfaces have been increased tremendously to enable high-data throughput while maintaining single-ended signaling and the supply voltage of I/O has been scaled down. Due to the increasing interface bandwidth the required area and power consumption has increased as well, resulting in higher I/O circuit design costs [3]. A high-loss channel causes ISI, which in turn limits the maximum data rate. Therefore, complex equalizers are needed for compensation, resulting in additional power dissipation and area overhead. As the data sampling rate increases, the deterministic and random noises degrade the data sampling margin and further limit the bandwidth. To lessen the negative impact of high channel loss and to reduce the forwarded clock frequency, multi-level signaling, such as PAM-4, can be used, as shown in Fig. 23.3.1 [2]. While the voltage sense margin for PAM-4 is theoretically frac{1}{3} of NRZ, in practice it is smaller due to simultaneous switching noise (SSN), crosstalk, and random noise in single-ended signaling. Eventually, the reduced voltage sense margin degrades the SNR, which causes a reduction in the BER. On the other hand, PAM-3's voltage sense margin is {textstyle frac {1}{2}} of NRZ's. Duo-binary signaling is commonly used for PAM-3 signaling [1]. However, the pin efficiency and the forwarded clock frequency for duo-binary signaling is the same as for NRZ. In this paper, a 3b/2UI PAM-3 single-ended memory interface is proposed, with a pin efficiency of 150% and a reduced clock frequency, compared to NRZ signaling. To address PAM-3 equalizer inefficiencies a tri-level decision feedback equalizer (DFE) is implemented in the receiver (RX).
AB - Bandwidths of memory interfaces have been increased tremendously to enable high-data throughput while maintaining single-ended signaling and the supply voltage of I/O has been scaled down. Due to the increasing interface bandwidth the required area and power consumption has increased as well, resulting in higher I/O circuit design costs [3]. A high-loss channel causes ISI, which in turn limits the maximum data rate. Therefore, complex equalizers are needed for compensation, resulting in additional power dissipation and area overhead. As the data sampling rate increases, the deterministic and random noises degrade the data sampling margin and further limit the bandwidth. To lessen the negative impact of high channel loss and to reduce the forwarded clock frequency, multi-level signaling, such as PAM-4, can be used, as shown in Fig. 23.3.1 [2]. While the voltage sense margin for PAM-4 is theoretically frac{1}{3} of NRZ, in practice it is smaller due to simultaneous switching noise (SSN), crosstalk, and random noise in single-ended signaling. Eventually, the reduced voltage sense margin degrades the SNR, which causes a reduction in the BER. On the other hand, PAM-3's voltage sense margin is {textstyle frac {1}{2}} of NRZ's. Duo-binary signaling is commonly used for PAM-3 signaling [1]. However, the pin efficiency and the forwarded clock frequency for duo-binary signaling is the same as for NRZ. In this paper, a 3b/2UI PAM-3 single-ended memory interface is proposed, with a pin efficiency of 150% and a reduced clock frequency, compared to NRZ signaling. To address PAM-3 equalizer inefficiencies a tri-level decision feedback equalizer (DFE) is implemented in the receiver (RX).
UR - http://www.scopus.com/inward/record.url?scp=85063460315&partnerID=8YFLogxK
U2 - 10.1109/ISSCC.2019.8662462
DO - 10.1109/ISSCC.2019.8662462
M3 - Conference contribution
AN - SCOPUS:85063460315
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 382
EP - 384
BT - 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
Y2 - 17 February 2019 through 21 February 2019
ER -