@inproceedings{b0e731d4c7d344c88d4c4476b592b706,
title = "3-Axes flexible tactile sensor fabricated by SI micromachining and packaging technology",
abstract = "We present the fabrication process and characteristics of a 3-axes flexible tactile sensor available for normal and shear mode fabricated using Si micromachining and packaging technologies. The fabrication processes for the 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1%/N and 0.5%/N in applying normal and shear force, respectively. Because this tactile sensor can measure the variations of resistance of the semiconductor strain gauge for normal and shear force, it can be used to sense touch, pressure, hardness, and slip.",
author = "K. Kim and Lee, {K. R.} and Kim, {Y. K.} and Lee, {D. S.} and Cho, {N. K.} and Kim, {W. H.} and Park, {K. B.} and Park, {H. D.} and Park, {Y. K.} and Kim, {J. H.} and Pak, {J. J.}",
year = "2006",
language = "English",
isbn = "0780394755",
series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",
pages = "678--681",
booktitle = "19th IEEE International Conference on Micro Electro Mechanical Systems",
note = "19th IEEE International Conference on Micro Electro Mechanical Systems ; Conference date: 22-01-2006 Through 26-01-2006",
}