32.2 A Stimulus-Scattering-Free Pixel-Sharing Sub-Retinal Prosthesis SoC with 35.8dB Dynamic Range Time-Based Photodiode Sensing and Per-Pixel Dynamic Voltage Scaling

Kyeongho Eom, Minju Park, Han Sol Lee, Seung Beom Ku, Namju Kim, Seongkwann Cha, Yong Sook Goo, Sohee Kim, Seong Woo Kim, Hyung Min Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Retinal prosthesis (RP) systems-on-chip (SoC) for the treatment of age-related macular degeneration (AMD) and retinal pigment degeneration have been widely studied for restoring visual function. RP SoCs allow the brain to perceive visual information by applying current stimuli to the retinal cells. An epi-retinal prosthesis (epi-RP) obtains image information from an external camera and provides appropriate stimuli to the ganglion cells [1]. On the other hand, a sub-retinal prosthesis (sub-RP) uses photodiodes (PD) to directly recognize light and stimulate bipolar cells [2]. Although the sub-RP SoC has potential to restore the patient's vision without bulky external devices, it suffers from three major problems that limit the functionality and safety.

Original languageEnglish
Title of host publication2023 IEEE International Solid-State Circuits Conference, ISSCC 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages480-482
Number of pages3
ISBN (Electronic)9781665428002
DOIs
Publication statusPublished - 2023
Event2023 IEEE International Solid-State Circuits Conference, ISSCC 2023 - Virtual, Online, United States
Duration: 2023 Feb 192023 Feb 23

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume2023-February
ISSN (Print)0193-6530

Conference

Conference2023 IEEE International Solid-State Circuits Conference, ISSCC 2023
Country/TerritoryUnited States
CityVirtual, Online
Period23/2/1923/2/23

Bibliographical note

Funding Information:
This work was supported by the National Research Foundation of Korea (NRF-2020R1F1A1074719) funded by Ministry of Science & ICT. Chip fabrication was supported by IC Design Education Center (IDEC), Korea.

Publisher Copyright:
© 2023 IEEE.

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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