32.2 A Stimulus-Scattering-Free Pixel-Sharing Sub-Retinal Prosthesis SoC with 35.8dB Dynamic Range Time-Based Photodiode Sensing and Per-Pixel Dynamic Voltage Scaling

  • Kyeongho Eom
  • , Minju Park
  • , Han Sol Lee
  • , Seung Beom Ku
  • , Namju Kim
  • , Seongkwann Cha
  • , Yong Sook Goo
  • , Sohee Kim
  • , Seong Woo Kim
  • , Hyung Min Lee

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    Retinal prosthesis (RP) systems-on-chip (SoC) for the treatment of age-related macular degeneration (AMD) and retinal pigment degeneration have been widely studied for restoring visual function. RP SoCs allow the brain to perceive visual information by applying current stimuli to the retinal cells. An epi-retinal prosthesis (epi-RP) obtains image information from an external camera and provides appropriate stimuli to the ganglion cells [1]. On the other hand, a sub-retinal prosthesis (sub-RP) uses photodiodes (PD) to directly recognize light and stimulate bipolar cells [2]. Although the sub-RP SoC has potential to restore the patient's vision without bulky external devices, it suffers from three major problems that limit the functionality and safety.

    Original languageEnglish
    Title of host publication2023 IEEE International Solid-State Circuits Conference, ISSCC 2023
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages480-482
    Number of pages3
    ISBN (Electronic)9781665428002
    DOIs
    Publication statusPublished - 2023
    Event2023 IEEE International Solid-State Circuits Conference, ISSCC 2023 - Virtual, Online, United States
    Duration: 2023 Feb 192023 Feb 23

    Publication series

    NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
    Volume2023-February
    ISSN (Print)0193-6530

    Conference

    Conference2023 IEEE International Solid-State Circuits Conference, ISSCC 2023
    Country/TerritoryUnited States
    CityVirtual, Online
    Period23/2/1923/2/23

    Bibliographical note

    Funding Information:
    This work was supported by the National Research Foundation of Korea (NRF-2020R1F1A1074719) funded by Ministry of Science & ICT. Chip fabrication was supported by IC Design Education Center (IDEC), Korea.

    Publisher Copyright:
    © 2023 IEEE.

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Electrical and Electronic Engineering

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