3D digital holographic semiconductor metrology using Fourier Modal Method

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	JSAP-OSA Joint Symposia, JSAP 2017
Publisher	Optica Publishing Group (formerly OSA)
ISBN (Print)	9784863486416
Publication status	Published - 2017
Event	JSAP-OSA Joint Symposia, JSAP 2017 - Fukuoka, Japan Duration: 2017 Sept 18 → 2017 Sept 21

Name	Optics InfoBase Conference Papers
Volume	Part F78-JSAP 2017
ISSN (Electronic)	2162-2701

ASJC Scopus subject areas

@inproceedings{bdd168e0a9f04c7bb7f803b3602da751,

title = "3D digital holographic semiconductor metrology using Fourier Modal Method",

author = "Park, \{Shin Woong\} and Lee, \{Jong Hyun\} and Hwi Kim",

year = "2017",

language = "English",

isbn = "9784863486416",

series = "Optics InfoBase Conference Papers",

publisher = "Optica Publishing Group (formerly OSA)",

booktitle = "JSAP-OSA Joint Symposia, JSAP 2017",

note = "JSAP-OSA Joint Symposia, JSAP 2017 ; Conference date: 18-09-2017 Through 21-09-2017",

}

TY - GEN

T1 - 3D digital holographic semiconductor metrology using Fourier Modal Method

AU - Park, Shin Woong

AU - Lee, Jong Hyun

AU - Kim, Hwi

PY - 2017

Y1 - 2017

UR - https://www.scopus.com/pages/publications/85039544328

M3 - Conference contribution

AN - SCOPUS:85039544328

SN - 9784863486416

T3 - Optics InfoBase Conference Papers

BT - JSAP-OSA Joint Symposia, JSAP 2017

PB - Optica Publishing Group (formerly OSA)

T2 - JSAP-OSA Joint Symposia, JSAP 2017

Y2 - 18 September 2017 through 21 September 2017

ER -