3D-feed horn antenna-coupled microbolometer

Kuntae Kim, Jong Yeon Park, Yong Hee Han, Ho Kwan Kang, Hyun Joon Shin, Sung Moon, Jung Ho Park

Research output: Contribution to journalConference articlepeer-review

8 Citations (Scopus)

Abstract

In this paper, we proposed a microbolometer coupled with 3D feed horn antenna. It is a new device that enhances the performance of the microbolometer by coupling 3D horn shape antenna. We designed the optimum horn antenna size that has 20.08dB directivity. And we designed the microbolometer as a circular shape in order to reduce the coupling loss between the horn antenna. We confirmed that the detectivity of the designed microbolometer would be improved as the noise characteristics of the microbolometer are enhanced by coupling feed horn antenna which acts as a cold shield. The detectivity of the designed 3D antenna-coupled microbolometer was improved about seven times more than that of the conventional microbolometer in state of background limited infrared performance. Fabrications of the microbolometer are carried out by a surface micromachining method. We achieved the thermally good isolated floating structure. And the 3D feed horn antenna was constructed by using a mirror-reflected parallel beam illuminator (MRPBI) system which is invented for rotating and tilted illumination. Using this method, we acquired the feed horn shape antenna mold. And we also acquired antenna plate by using PDMS injection method. Finally, to couple the antenna and the microbolometer, we proposed the PDMS injection bonding method.

Original languageEnglish
Pages (from-to)196-205
Number of pages10
JournalSensors and Actuators, A: Physical
Volume110
Issue number1-3
DOIs
Publication statusPublished - 2004 Feb 1
EventSelected Papers from Eurosensors XVI Prague, Czech Republic - Prague, Czech Republic
Duration: 2002 Sept 152002 Sept 18

Keywords

  • Detectivity
  • Feed horn antenna
  • Microbolometer

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering

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