3D MEMS antenna for IR sensor using novel UV-lithography, plastic micromachining and mesh structure bonding technique

Jong Yeon Park; Kun Tae Kim; Sung Moon; James Jungho Pak

doi:10.1109/OMEMS.2003.1233476

3D MEMS antenna for IR sensor using novel UV-lithography, plastic micromachining and mesh structure bonding technique

Jong Yeon Park, Kun Tae Kim, Sung Moon, James Jungho Pak

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

This paper describes the novel UV-lithography technique for fabrication of 3D feed horn mold structure array using implementation of mirror reflected parallel beam illuminator (MRPBI) system, fabrication of 3D feed horn MEMS antenna's plate using plastic micromachining (PMM) by polydimethylsiloxane (PDMS) and the 3D MEMS antenna array are assembled using novel 3D MEMS bonding technique by mesh structure bonding (MSB) method.

Original language	English
Title of host publication	2003 IEEE/LEOS International Conference on Optical MEMS
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	79-80
Number of pages	2
ISBN (Print)	078037830X, 9780780378308
DOIs	https://doi.org/10.1109/OMEMS.2003.1233476
Publication status	Published - 2003
Event	2003 IEEE/LEOS International Conference on Optical MEMS - Waikoloa, United States Duration: 2003 Aug 18 → 2003 Aug 21

Other

Other	2003 IEEE/LEOS International Conference on Optical MEMS
Country/Territory	United States
City	Waikoloa
Period	03/8/18 → 03/8/21

Keywords

Antenna arrays
Bonding
Fabrication
Feeds
Horn antennas
Infrared sensors
Micromachining
Micromechanical devices
Plastics
Reflector antennas

ASJC Scopus subject areas

General Engineering

Access to Document

10.1109/OMEMS.2003.1233476

Cite this

3D MEMS antenna for IR sensor using novel UV-lithography, plastic micromachining and mesh structure bonding technique. / Park, Jong Yeon; Kim, Kun Tae; Moon, Sung et al.
2003 IEEE/LEOS International Conference on Optical MEMS. Institute of Electrical and Electronics Engineers Inc., 2003. p. 79-80 1233476.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Park, JY, Kim, KT, Moon, S & Pak, JJ 2003, 3D MEMS antenna for IR sensor using novel UV-lithography, plastic micromachining and mesh structure bonding technique. in 2003 IEEE/LEOS International Conference on Optical MEMS., 1233476, Institute of Electrical and Electronics Engineers Inc., pp. 79-80, 2003 IEEE/LEOS International Conference on Optical MEMS, Waikoloa, United States, 03/8/18. https://doi.org/10.1109/OMEMS.2003.1233476

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abstract = "This paper describes the novel UV-lithography technique for fabrication of 3D feed horn mold structure array using implementation of mirror reflected parallel beam illuminator (MRPBI) system, fabrication of 3D feed horn MEMS antenna's plate using plastic micromachining (PMM) by polydimethylsiloxane (PDMS) and the 3D MEMS antenna array are assembled using novel 3D MEMS bonding technique by mesh structure bonding (MSB) method.",

keywords = "Antenna arrays, Bonding, Fabrication, Feeds, Horn antennas, Infrared sensors, Micromachining, Micromechanical devices, Plastics, Reflector antennas",

author = "Park, {Jong Yeon} and Kim, {Kun Tae} and Sung Moon and Pak, {James Jungho}",

year = "2003",

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AB - This paper describes the novel UV-lithography technique for fabrication of 3D feed horn mold structure array using implementation of mirror reflected parallel beam illuminator (MRPBI) system, fabrication of 3D feed horn MEMS antenna's plate using plastic micromachining (PMM) by polydimethylsiloxane (PDMS) and the 3D MEMS antenna array are assembled using novel 3D MEMS bonding technique by mesh structure bonding (MSB) method.

KW - Antenna arrays

KW - Bonding

KW - Fabrication

KW - Feeds

KW - Horn antennas

KW - Infrared sensors

KW - Micromachining

KW - Micromechanical devices

KW - Plastics

KW - Reflector antennas

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BT - 2003 IEEE/LEOS International Conference on Optical MEMS

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3D MEMS antenna for IR sensor using novel UV-lithography, plastic micromachining and mesh structure bonding technique

Abstract

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Keywords

ASJC Scopus subject areas

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