64-channel double-layered sieve electrode with increased porosity for improved axon regeneration and high spatial resolution

Jinwoo Jeong, Woohyun Jung, Ockchul Kim, Jun Uk Chu, Inchan Youn, Keehoon Kim, Sang Rok Oh, Jong Woong Park, Jinseok Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

14 Citations (Scopus)

Abstract

Double-layered sieve-Type neural electrode with high channel density is suggested for peripheral nerve interface. The neural electrode has double channel density due to its two separated metal layers including electrodes and distribution interconnects. Also it can be utilized to acquire and stimulate throughout the whole nerve cross-section. The measurement results of the electrochemical impedance confirm that the fabricated neural electrode has the neural signal recording feasibility. In-vivo implantation of the device is performed and functional recovery has been investigated. From the preliminary experimental results, new improved device design with higher porosity is suggested for next step.

Original languageEnglish
Title of host publication2016 6th IEEE International Conference on Biomedical Robotics and Biomechatronics, BioRob 2016
PublisherIEEE Computer Society
Pages1148-1153
Number of pages6
ISBN (Electronic)9781509032877
DOIs
Publication statusPublished - 2016 Jul 26
Externally publishedYes
Event6th IEEE RAS/EMBS International Conference on Biomedical Robotics and Biomechatronics, BioRob 2016 - Singapore, Singapore
Duration: 2016 Jun 262016 Jun 29

Publication series

NameProceedings of the IEEE RAS and EMBS International Conference on Biomedical Robotics and Biomechatronics
Volume2016-July
ISSN (Print)2155-1774

Other

Other6th IEEE RAS/EMBS International Conference on Biomedical Robotics and Biomechatronics, BioRob 2016
Country/TerritorySingapore
CitySingapore
Period16/6/2616/6/29

Bibliographical note

Publisher Copyright:
© 2016 IEEE.

ASJC Scopus subject areas

  • Artificial Intelligence
  • Biomedical Engineering
  • Mechanical Engineering

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