Abstract
The bandwidth of parallel DRAM I/O has increased to meet big-data requirements. High bandwidth memory (HBM) interfaces use up to 1024 pins, and with an increased clock frequency, their power consumption has also increased [1]. Figure 28.5.1 shows four HBM interface approaches. Conventional HBM interfaces use a termination-less structure at the receiver to reduce power consumption. For higher data rates receiver-side termination can be used to improve signal integrity. However, this causes a large static current for long consecutive identical digits (CID). Di-code signaling can be used in HBM interfaces to reduce this static current. Nevertheless, there are still design constraints for conventional di-code interfaces, such as equalization, offset voltage, and series capacitor implementation constraints [2]. The series capacitor, specifically, causes frequency dependence and parasitic capacitance, which degrades its frequency range. In this paper, a capacitor-less and high-efficiency di-code transceiver using trans-impedance-amplifier (TIA) termination is implemented, as shown in Fig. 28.5.1. An adjustable inverter-based TIA is adopted for DC balancing the di-code signaling. A common-mode voltage calibration technique is proposed to minimize the static current during middle-level transmission. Several equalizing techniques for the di-code signaling are proposed to increase the sampling margin at the receiver and to maintain the common-mode voltage of di-code outputs. Also, an error correction circuit (ECC), based on di-code signaling, is implemented to reduce bit errors.
| Original language | English |
|---|---|
| Title of host publication | 2022 IEEE International Solid-State Circuits Conference, ISSCC 2022 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 452-454 |
| Number of pages | 3 |
| ISBN (Electronic) | 9781665428002 |
| DOIs | |
| Publication status | Published - 2022 |
| Event | 2022 IEEE International Solid-State Circuits Conference, ISSCC 2022 - San Francisco, United States Duration: 2022 Feb 20 → 2022 Feb 26 |
Publication series
| Name | Digest of Technical Papers - IEEE International Solid-State Circuits Conference |
|---|---|
| Volume | 2022-February |
| ISSN (Print) | 0193-6530 |
Conference
| Conference | 2022 IEEE International Solid-State Circuits Conference, ISSCC 2022 |
|---|---|
| Country/Territory | United States |
| City | San Francisco |
| Period | 22/2/20 → 22/2/26 |
Bibliographical note
Funding Information:This work was supported by an Institute for Information & Communication Technology Promotion (IITP) grant, funded by the Korean government (MISP) (No. 2020-0-01300, Development of AI-specific parallel high-speed memory interface).
Publisher Copyright:
© 2022 IEEE.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering
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