Engineering
Chemical Vapor Deposition
100%
Vapor Deposition
100%
Microfluidic Device
100%
Polydimethylsiloxane
66%
Adhesive Layer
66%
Microchannel
33%
Polycarbonate
33%
Silicon Wafer
33%
Flexible Substrate
33%
Plasma Treatment
33%
Covalent
33%
Monomer
33%
Ethylene Terephthalate
33%
Individual Part
33%
Adhesive Strength
33%
Nanofluidics
33%
Channel Structure
33%
Nanolayers
33%
Petri Dish
33%
Silicon Dioxide
33%
Flat Surface
33%
Keyphrases
Microfluidic Device
100%
Bioadhesive
100%
ICVD
100%
Glycidyl Methacrylate
50%
Polydimethylsiloxane
33%
Polyallylamine
33%
Adhesive Layer
33%
Commercially Available
16%
Microchannel Structure
16%
Silica
16%
Polystyrene
16%
High Strength
16%
Ethylene
16%
Polyethylene Terephthalate
16%
Epoxy
16%
Polymerized
16%
Silicon Wafer
16%
Flexible Substrate
16%
Nanodevices
16%
Plasma Treatment
16%
Nanochannel
16%
Petri Dish
16%
Flat Surface
16%
Substrate Type
16%
Micro-nano
16%
Nanolayers
16%
Polymeric Materials
16%
Sealing Method
16%
Post-curing
16%
Adhesive Strength
16%
Nanofluidic Devices
16%
Inorganic Materials
16%
Complementary Pair
16%
Conformal Coverage
16%
Sealing Glass
16%
Cross-sectional Profile
16%
Outgassing
16%
Material Science
Chemical Vapor Deposition
100%
Poly(Dimethylsiloxane)
66%
Polystyrene
33%
Polyethylene Terephthalate
33%
Polycarbonate
33%
Silicon Wafer
33%
Nanofluidics
33%
Surface (Surface Science)
33%