A dry release of polyimide electrodes using Kapton film and application to EEG signal measurements

Dong Hyun Baek, Jin Hee Moon, Yoon Young Choi, Mina Lee, Jee Hyun Choi, James Jungho Pak, Sang Hoon Lee

Research output: Contribution to journalArticlepeer-review

14 Citations (Scopus)


We describe here a simple and novel method to fabricate polyimide (PI) electrodes without a complex process to release completed PI electrodes from the substrates after full-curing process. We separated the PI electrodes from the Si-wafer prior to full-curing process, and these non full-cured electrodes were placed between the Kapton films, and we performed full-curing process with these sandwiched electrodes. Then, PI electrodes were easily and clearly released from the substrate without the sacrificial layers. We assessed the mechanical properties of fabricated electrodes comparing with non full-cured PI electrodes to investigate the full-curing effect between Kapton films. The electrical property was evaluated by measuring the impedance. Testing of the cyto-toxicity of full-cured electrodes using human mesenchymal stem cells (hMSCs) and mouse fibroblasts (L929) was carried out and the electrodes fabricated by proposed method were nontoxic and could be used as implantable electrodes. We also found that the electrodes, uniformly spread on the surface of mouse skulls while maintaining close contact, could successfully measure multichannel EEG signals.

Original languageEnglish
Pages (from-to)7-14
Number of pages8
JournalMicrosystem Technologies
Issue number1
Publication statusPublished - 2011 Jan

Bibliographical note

Funding Information:
This work was supported by grand No. 10031779 from the Strategic Technology Development Program of Ministry of Knowledge Economy. This research was supported by a grant (M103KV010025-08K2201-02510) from Brain Research Center of the 21st Century Frontier Research Program funded by the Ministry of Science and Technology, the Republic of Korea.

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Hardware and Architecture
  • Electrical and Electronic Engineering


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