Abstract
In automated Tape substrate (TS) inspection, machine vision is widely adopted for their high throughput and cost advantages. However, conventional methods are overly sensitive to foreign particles or have limitations in detecting three dimensional defects such as top over-etching. In an attempt to complement vision inspection systems, we proposed utilizing x-ray inspection. To implement x-ray inspection in TS application, we developed a prototype fast and high spatial resolution x-ray imaging sensor which functions at frame rate in excess of 30 fps and has a spatial resolution of 20 μm. In this paper, the development of the sensor and its performance is addressed and the efficiency of the x-ray inspection in detecting top over-etching defects will be shown with experimental studies.
| Original language | English |
|---|---|
| Article number | 72660Q |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 7266 |
| DOIs | |
| Publication status | Published - 2008 |
| Externally published | Yes |
| Event | Optomechatronic Technologies 2008 - San Diego, CA, United States Duration: 2008 Nov 17 → 2008 Nov 19 |
Keywords
- Inspection
- Tape substrate
- Top over-etched
- X-ray
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering