A fast and high resolution X-ray imaging sensor for tape substrate inspection

Jung Yeol Yeom, Young Jun Roh, Chang Ook Jung, Dae Hwa Jeong

Research output: Contribution to journalConference articlepeer-review


In automated Tape substrate (TS) inspection, machine vision is widely adopted for their high throughput and cost advantages. However, conventional methods are overly sensitive to foreign particles or have limitations in detecting three dimensional defects such as top over-etching. In an attempt to complement vision inspection systems, we proposed utilizing x-ray inspection. To implement x-ray inspection in TS application, we developed a prototype fast and high spatial resolution x-ray imaging sensor which functions at frame rate in excess of 30 fps and has a spatial resolution of 20 μm. In this paper, the development of the sensor and its performance is addressed and the efficiency of the x-ray inspection in detecting top over-etching defects will be shown with experimental studies.

Original languageEnglish
Article number72660Q
JournalProceedings of SPIE - The International Society for Optical Engineering
Publication statusPublished - 2008
Externally publishedYes
EventOptomechatronic Technologies 2008 - San Diego, CA, United States
Duration: 2008 Nov 172008 Nov 19


  • Inspection
  • Tape substrate
  • Top over-etched
  • X-ray

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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