TY - GEN
T1 - A high-performance processing-in-memory accelerator for inline data deduplication
AU - Lee, Young Seo
AU - Kim, Kyung Min
AU - Lee, Ji Heon
AU - Choi, Jeong Hwan
AU - Chung, Sung Woo
PY - 2019/11
Y1 - 2019/11
N2 - In data centers, inline data deduplication which eliminates redundant data on the fly, is crucial to significantly reduce storage cost. However, it causes substantial performance and energy overhead due to a large number of memory accesses in the conventional GPU. In this paper, we propose a highperformance processing-in-memory accelerator for inline data deduplication, called Deduplication Unit (DU) to reduce the latency and power consumption. We place the DUs in a base die or core dies of a 3D stacked memory to improve performance. Our simulation results show that the DUs in the base die reduce the latency and processing unit power consumption by 17.3% and 45.5%, on average, respectively, compared to the conventional GPU. In addition, in our thermal simulation, peak temperature of the DU is still lower than the threshold temperature.
AB - In data centers, inline data deduplication which eliminates redundant data on the fly, is crucial to significantly reduce storage cost. However, it causes substantial performance and energy overhead due to a large number of memory accesses in the conventional GPU. In this paper, we propose a highperformance processing-in-memory accelerator for inline data deduplication, called Deduplication Unit (DU) to reduce the latency and power consumption. We place the DUs in a base die or core dies of a 3D stacked memory to improve performance. Our simulation results show that the DUs in the base die reduce the latency and processing unit power consumption by 17.3% and 45.5%, on average, respectively, compared to the conventional GPU. In addition, in our thermal simulation, peak temperature of the DU is still lower than the threshold temperature.
KW - 3D stacked memory
KW - Accelerator
KW - Inline data deduplication
KW - Processing in memory
UR - http://www.scopus.com/inward/record.url?scp=85081167323&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85081167323&partnerID=8YFLogxK
U2 - 10.1109/ICCD46524.2019.00077
DO - 10.1109/ICCD46524.2019.00077
M3 - Conference contribution
T3 - Proceedings - 2019 IEEE International Conference on Computer Design, ICCD 2019
SP - 515
EP - 523
BT - Proceedings - 2019 IEEE International Conference on Computer Design, ICCD 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 37th IEEE International Conference on Computer Design, ICCD 2019
Y2 - 17 November 2019 through 20 November 2019
ER -