Abstract
This paper presents a vertical magnetometer-accelerometer capable of detecting simultaneously both the acceleration and the geomagnetic field. The conceived sensor detects the magnetic field by the Lorentz force and differentiates the magnetic field and the acceleration by the modulated frequency difference. The process uses a silicon-on-glass (SOG) wafer and the goldsilicon eutectic bonding for the wafer-level hermetic packaging. When the 10 mA current flows through the conductor, the measured resistances are an average of 10Ω, so in total, 1 mW is consumed in the current driving element. When 35 μT and lg is applied to the sensor at the same time, the fusion sensor has a sensitivity of 73 mV/g in acceleration sensing mode, and a sensitivity of approximately 1.63mV/μT in magnetic field sensing mode. This newly developed sensor can be used in portable navigators that need a small size, low cost and low power electronic compass.
Original language | English |
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Pages (from-to) | 5432-5437 |
Number of pages | 6 |
Journal | Japanese journal of applied physics |
Volume | 47 |
Issue number | 7 PART 1 |
DOIs | |
Publication status | Published - 2008 Jul 11 |
Keywords
- Bulk-micromachining
- Eutectic bonding
- Lorentz force
- MEMS
- Magnetometer-accelerometer
- Silicon-on-glass wafer
ASJC Scopus subject areas
- Engineering(all)
- Physics and Astronomy(all)