A novel layer shaping method to reduce far-end crosstalk noise in microstrip lines using 3D printer

Jaehyuk Lim; Seungjin Lee; Jaehoon Lee

doi:10.1109/AMS48904.2020.9059422

A novel layer shaping method to reduce far-end crosstalk noise in microstrip lines using 3D printer

Jaehyuk Lim, Seungjin Lee, Jaehoon Lee

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

In this paper, a novel layer shaping method to reduce far-end crosstalk (FEXT) noise in multiple microstrip lines was proposed. To reduce FEXT noise induced in adjacent microstrip lines, mushroom-shaped dielectric structure (MSDS) was created between the microstrip lines. The prototypes were fabricated using 3D printer to avoid increased complexity, and the effect of the proposed MSDS was verifiedfrom simulated and measured results.

Original language	English
Title of host publication	2020 4th Australian Microwave Symposium, AMS 2020
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728147840
DOIs	https://doi.org/10.1109/AMS48904.2020.9059422
Publication status	Published - 2020 Feb
Event	4th Australian Microwave Symposium, AMS 2020 - Sydney, Australia Duration: 2020 Feb 13 → 2020 Feb 14

Publication series

Name	2020 4th Australian Microwave Symposium, AMS 2020

Conference

Conference	4th Australian Microwave Symposium, AMS 2020
Country/Territory	Australia
City	Sydney
Period	20/2/13 → 20/2/14

Bibliographical note

Funding Information:
ACKNOWLEDGMENT This work was supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF), funded by the Ministry of Education, Science, and Technology, Rep. of Korea (NRF - 2018R1D1A1B07049347).

Publisher Copyright:
© 2020 IEEE.

Keywords

3D printer
Far-end crosstalk (FEXT)
Layer shaping method
Mushroom-shaped dielectric structure(MSDS)

ASJC Scopus subject areas

Computer Networks and Communications
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Instrumentation

Access to Document

10.1109/AMS48904.2020.9059422

Cite this

A novel layer shaping method to reduce far-end crosstalk noise in microstrip lines using 3D printer. / Lim, Jaehyuk; Lee, Seungjin; Lee, Jaehoon.
2020 4th Australian Microwave Symposium, AMS 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9059422 (2020 4th Australian Microwave Symposium, AMS 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Lim, J, Lee, S & Lee, J 2020, A novel layer shaping method to reduce far-end crosstalk noise in microstrip lines using 3D printer. in 2020 4th Australian Microwave Symposium, AMS 2020., 9059422, 2020 4th Australian Microwave Symposium, AMS 2020, Institute of Electrical and Electronics Engineers Inc., 4th Australian Microwave Symposium, AMS 2020, Sydney, Australia, 20/2/13. https://doi.org/10.1109/AMS48904.2020.9059422

@inproceedings{8ddd9712157e43fa9a4b0de71fe7e0d0,

title = "A novel layer shaping method to reduce far-end crosstalk noise in microstrip lines using 3D printer",

abstract = "In this paper, a novel layer shaping method to reduce far-end crosstalk (FEXT) noise in multiple microstrip lines was proposed. To reduce FEXT noise induced in adjacent microstrip lines, mushroom-shaped dielectric structure (MSDS) was created between the microstrip lines. The prototypes were fabricated using 3D printer to avoid increased complexity, and the effect of the proposed MSDS was verifiedfrom simulated and measured results.",

keywords = "3D printer, Far-end crosstalk (FEXT), Layer shaping method, Mushroom-shaped dielectric structure(MSDS)",

author = "Jaehyuk Lim and Seungjin Lee and Jaehoon Lee",

note = "Funding Information: ACKNOWLEDGMENT This work was supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF), funded by the Ministry of Education, Science, and Technology, Rep. of Korea (NRF - 2018R1D1A1B07049347). Publisher Copyright: {\textcopyright} 2020 IEEE.; 4th Australian Microwave Symposium, AMS 2020 ; Conference date: 13-02-2020 Through 14-02-2020",

year = "2020",

month = feb,

doi = "10.1109/AMS48904.2020.9059422",

language = "English",

series = "2020 4th Australian Microwave Symposium, AMS 2020",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2020 4th Australian Microwave Symposium, AMS 2020",

}

TY - GEN

T1 - A novel layer shaping method to reduce far-end crosstalk noise in microstrip lines using 3D printer

AU - Lim, Jaehyuk

AU - Lee, Seungjin

AU - Lee, Jaehoon

N1 - Funding Information: ACKNOWLEDGMENT This work was supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF), funded by the Ministry of Education, Science, and Technology, Rep. of Korea (NRF - 2018R1D1A1B07049347). Publisher Copyright: © 2020 IEEE.

PY - 2020/2

Y1 - 2020/2

N2 - In this paper, a novel layer shaping method to reduce far-end crosstalk (FEXT) noise in multiple microstrip lines was proposed. To reduce FEXT noise induced in adjacent microstrip lines, mushroom-shaped dielectric structure (MSDS) was created between the microstrip lines. The prototypes were fabricated using 3D printer to avoid increased complexity, and the effect of the proposed MSDS was verifiedfrom simulated and measured results.

AB - In this paper, a novel layer shaping method to reduce far-end crosstalk (FEXT) noise in multiple microstrip lines was proposed. To reduce FEXT noise induced in adjacent microstrip lines, mushroom-shaped dielectric structure (MSDS) was created between the microstrip lines. The prototypes were fabricated using 3D printer to avoid increased complexity, and the effect of the proposed MSDS was verifiedfrom simulated and measured results.

KW - 3D printer

KW - Far-end crosstalk (FEXT)

KW - Layer shaping method

KW - Mushroom-shaped dielectric structure(MSDS)

UR - http://www.scopus.com/inward/record.url?scp=85084181957&partnerID=8YFLogxK

U2 - 10.1109/AMS48904.2020.9059422

DO - 10.1109/AMS48904.2020.9059422

M3 - Conference contribution

AN - SCOPUS:85084181957

T3 - 2020 4th Australian Microwave Symposium, AMS 2020

BT - 2020 4th Australian Microwave Symposium, AMS 2020

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 4th Australian Microwave Symposium, AMS 2020

Y2 - 13 February 2020 through 14 February 2020

ER -

A novel layer shaping method to reduce far-end crosstalk noise in microstrip lines using 3D printer

Abstract

Publication series

Conference

Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

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