A novel low-loss wafer-level packaging of the RF-MEMS devices

Yun Kwon Park, Heung Woo Park, Duck Jung Lee, Jung Ho Park, In Sang Song, Chung Woo Kim, Ci Moo Song, Yun Hi Lee, Chul Ju Kim, Byeong Kwon Ju

Research output: Contribution to journalArticlepeer-review

41 Citations (Scopus)


In this work, the flip-chip method was used for packaging of the RF-MEMS switch on the quartz substrate with low losses. The 4-inch Pyrex glass was used as a package substrate and it was punched with airblast with 250 μm diameter holes. The Cr/Au seed layer was deposited on it and the vias were filled with plating gold. After forming the molds on the holes with thick photoresist, the bumps were plated on holes. The package substrate was bonded with the quartz substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within - 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

Original languageEnglish
Pages (from-to)681-684
Number of pages4
JournalProceedings of the IEEE Micro Electro Mechanical Systems (MEMS)
Publication statusPublished - 2002

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering
  • Control and Systems Engineering


Dive into the research topics of 'A novel low-loss wafer-level packaging of the RF-MEMS devices'. Together they form a unique fingerprint.

Cite this