A novel low-loss wafer-level packaging of the RF-MEMS devices

Yun Kwon Park, Heung Woo Park, Duck Jung Lee, Jung Ho Park, In Sang Song, Chung Woo Kim, Ci Moo Song, Yun Hi Lee, Chul Ju Kim, Byeong Kwon Ju

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

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Engineering & Materials Science