@inproceedings{90f81b3997284c339235fa3b982dd2c7,
title = "A novel low-temperature microcap packaging using SU-8 bonding",
abstract = "In this paper, we report a new technology for lightweight, low temperature bonding process with thin film polymer microcap. Polymer (SU-8) was used both for the intermediate adhesive layer and as a cap structure. Silicon oxide thin film was deposited using furnace to separate the microcap from the carrier wafer. The measured tensile strength of the package is in the range of 7-17MPa. This thin-film polymer microcap on the host wafer was successfully demonstrated through low-temperature bonding and bulk micromachining. The experimental result shows that relatively high bonding strength at low bonding temperature can be achieved.",
keywords = "Bonding, Low temperature, Microcap, SU-8",
author = "Kim, {Y. K.} and Yi, {S. H.} and Kim, {S. W.} and Ju, {B. K.}",
year = "2007",
doi = "10.1109/SENSOR.2007.4300581",
language = "English",
isbn = "1424408423",
series = "TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems",
pages = "2107--2110",
booktitle = "TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems",
note = "4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07 ; Conference date: 10-06-2007 Through 14-06-2007",
}