A novel one-body dual laser profile based vibration compensation in 3D scanning

Yongseok Lim, Woong Choi, Yongju Park, Sangwook Oh, Younghun Kim, Jongsun Park

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

Abstract

Recently, the 3D laser profile scanner has often been used for the precise measurement of 3D surface information (object surface) such as height, area, and slope. However, a difficulty encountered with the conventional laser scanning method is that it cannot compensate for the errors resulting from vibration, so the scanned object should be measured in a fixed (immobile) state. In this paper, we propose a novel dual laser profile method and its error compensation algorithm to compensate for vertical vibration, even with a moving object. In order to remove errors caused by vibration, the proposed system projects two laser profiles onto the surface, such that the projected position overlaps the one with the previous position. With the overlapped position, the height difference between the measured objects is used to calculate the vibration errors. To generate two laser profiles simultaneously, we present a novel approach for generating two laser profiles from one laser-emitting source (a one-body dual line laser using a triangular structured blazed grating reflector). By exploiting the one-body dual line laser and error compensation algorithm, the proposed 3D laser profile scanner system achieves an error reduction of about 96.3% in the root mean square error (RMSE), compared to the conventional approach.

Original languageEnglish
Pages (from-to)455-466
Number of pages12
JournalMeasurement: Journal of the International Measurement Confederation
Volume130
DOIs
Publication statusPublished - 2018 Dec

Bibliographical note

Funding Information:
This work was funded in part by the National Research Foundation of Korea under Grant NRF-2016R1A2B4015329, in part by the MSIT (Ministry of Science and ICT), Korea, under the ITRC (Information Technology Research Center) support program (IITP-2018-0-01433) supervised by the IITP (Institute for Information & communications Technology Promotion), and in part by the IT R&D Program of KEIT supported by the Korea Government (MOTIE) (No. 10063314).

Publisher Copyright:
© 2018 Elsevier Ltd

Keywords

  • 3D (3-dimension) scanning
  • Dual laser profile
  • Laser profile
  • Laser profile scanner
  • Vibration compensation

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

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