A novel thin chip scale packaging of the RF-MEMS devices using ultra thin silicon

Engineering

• Insertion Loss 50%
• Microelectromechanical System 100%
• Patterning Process 50%
• Reflection Loss 50%
• Scattering Parameters 50%
• Silicon Substrate 50%
• Silicon Wafer 50%
• Waveguide 50%

Material Science

• Electroplating 50%
• Microelectromechanical System 100%
• Reactive Ion Etching 50%
• Silicon 100%
• Silicon Wafer 50%
• Waveguide 50%

Keyphrases

• Parasitism Capacity 50%
• Thin chip 100%