A strategy for dual-networked epoxy composite systems toward high cross-linking density and solid interfacial adhesion

Heun Young Seo; Dohyun Im; Young Je Kwon; Chae Yun Nam; Se Hun Kim; Taegu Nam; Changki Kim; E. Vivek; Kyong Youl Baek; Kie Yong Cho; Ho Gyu Yoon

doi:10.1016/j.compositesb.2023.110564

A strategy for dual-networked epoxy composite systems toward high cross-linking density and solid interfacial adhesion

Heun Young Seo, Dohyun Im, Young Je Kwon, Chae Yun Nam, Se Hun Kim, Taegu Nam, Changki Kim, E. Vivek, Kyong Youl Baek, Kie Yong Cho, Ho Gyu Yoon

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

Epoxy composites (ECs) are used as epoxy molding compound (EMC), which significantly protects the integrated circuits from the humid environment. One of the major limitations with ECs is their phenomena of moisture absorption in humid environments, which drastically reduces their mechanical properties and hinders them from gaining widespread industrial applications. The low cross-linking density of conventional epoxy composites that can lead to intrinsically providing hydrophilic sites and low activation energy in water molecule diffusion. Herein, a dual-networked epoxy composite system as a platform technique by adopting strategically designed poly (methyl methacrylate)-b-(dimethyl aminoethyl methacrylate) (PMD) as polymer compatibilizer to improve the water absorption resistance and mechanical properties derived from good interfacial adhesion and high cross-linking density of epoxy/silica composites were investigated. The as-prepared dual-networked epoxy composite system demonstrates a high-water absorption suppression of about 166.78% and a high tensile modulus of 4.6 GPa, compared to other epoxy composites. In addition, the current strategy has excellent expandability to various fillers also applicable to diverse epoxy composite systems.

Original language	English
Article number	110564
Journal	Composites Part B: Engineering
Volume	254
DOIs	https://doi.org/10.1016/j.compositesb.2023.110564
Publication status	Published - 2023 Apr 1

Bibliographical note

Funding Information:
H. G. Yoon acknowledges the financial support through a grant from Korea University and was partially supported by the Technology Innovation Program (Project No. 20003956 ) funded by the Ministry of Trade, Industry & Energy (MOTIE, South Korea) . K. Y. Cho acknowledges the financial support from the Pukyong National University Research Fund in 2020 ( CD20200837 ) and the Technology Innovation Program (Project No. 20008653 ) funded by the Ministry of Trade, Industry & Energy (MOTIE, South Korea) .

Publisher Copyright:
© 2023 Elsevier Ltd

ASJC Scopus subject areas

Ceramics and Composites
Mechanics of Materials
Mechanical Engineering
Industrial and Manufacturing Engineering

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10.1016/j.compositesb.2023.110564

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title = "A strategy for dual-networked epoxy composite systems toward high cross-linking density and solid interfacial adhesion",

abstract = "Epoxy composites (ECs) are used as epoxy molding compound (EMC), which significantly protects the integrated circuits from the humid environment. One of the major limitations with ECs is their phenomena of moisture absorption in humid environments, which drastically reduces their mechanical properties and hinders them from gaining widespread industrial applications. The low cross-linking density of conventional epoxy composites that can lead to intrinsically providing hydrophilic sites and low activation energy in water molecule diffusion. Herein, a dual-networked epoxy composite system as a platform technique by adopting strategically designed poly (methyl methacrylate)-b-(dimethyl aminoethyl methacrylate) (PMD) as polymer compatibilizer to improve the water absorption resistance and mechanical properties derived from good interfacial adhesion and high cross-linking density of epoxy/silica composites were investigated. The as-prepared dual-networked epoxy composite system demonstrates a high-water absorption suppression of about 166.78% and a high tensile modulus of 4.6 GPa, compared to other epoxy composites. In addition, the current strategy has excellent expandability to various fillers also applicable to diverse epoxy composite systems.",

author = "Seo, {Heun Young} and Dohyun Im and Kwon, {Young Je} and Nam, {Chae Yun} and Kim, {Se Hun} and Taegu Nam and Changki Kim and E. Vivek and Baek, {Kyong Youl} and Cho, {Kie Yong} and Yoon, {Ho Gyu}",

note = "Funding Information: H. G. Yoon acknowledges the financial support through a grant from Korea University and was partially supported by the Technology Innovation Program (Project No. 20003956 ) funded by the Ministry of Trade, Industry & Energy (MOTIE, South Korea) . K. Y. Cho acknowledges the financial support from the Pukyong National University Research Fund in 2020 ( CD20200837 ) and the Technology Innovation Program (Project No. 20008653 ) funded by the Ministry of Trade, Industry & Energy (MOTIE, South Korea) . Publisher Copyright: {\textcopyright} 2023 Elsevier Ltd",

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AU - Seo, Heun Young

AU - Im, Dohyun

AU - Kwon, Young Je

AU - Nam, Chae Yun

AU - Kim, Se Hun

AU - Nam, Taegu

AU - Kim, Changki

AU - Vivek, E.

AU - Baek, Kyong Youl

AU - Cho, Kie Yong

AU - Yoon, Ho Gyu

N1 - Funding Information: H. G. Yoon acknowledges the financial support through a grant from Korea University and was partially supported by the Technology Innovation Program (Project No. 20003956 ) funded by the Ministry of Trade, Industry & Energy (MOTIE, South Korea) . K. Y. Cho acknowledges the financial support from the Pukyong National University Research Fund in 2020 ( CD20200837 ) and the Technology Innovation Program (Project No. 20008653 ) funded by the Ministry of Trade, Industry & Energy (MOTIE, South Korea) . Publisher Copyright: © 2023 Elsevier Ltd

PY - 2023/4/1

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N2 - Epoxy composites (ECs) are used as epoxy molding compound (EMC), which significantly protects the integrated circuits from the humid environment. One of the major limitations with ECs is their phenomena of moisture absorption in humid environments, which drastically reduces their mechanical properties and hinders them from gaining widespread industrial applications. The low cross-linking density of conventional epoxy composites that can lead to intrinsically providing hydrophilic sites and low activation energy in water molecule diffusion. Herein, a dual-networked epoxy composite system as a platform technique by adopting strategically designed poly (methyl methacrylate)-b-(dimethyl aminoethyl methacrylate) (PMD) as polymer compatibilizer to improve the water absorption resistance and mechanical properties derived from good interfacial adhesion and high cross-linking density of epoxy/silica composites were investigated. The as-prepared dual-networked epoxy composite system demonstrates a high-water absorption suppression of about 166.78% and a high tensile modulus of 4.6 GPa, compared to other epoxy composites. In addition, the current strategy has excellent expandability to various fillers also applicable to diverse epoxy composite systems.

AB - Epoxy composites (ECs) are used as epoxy molding compound (EMC), which significantly protects the integrated circuits from the humid environment. One of the major limitations with ECs is their phenomena of moisture absorption in humid environments, which drastically reduces their mechanical properties and hinders them from gaining widespread industrial applications. The low cross-linking density of conventional epoxy composites that can lead to intrinsically providing hydrophilic sites and low activation energy in water molecule diffusion. Herein, a dual-networked epoxy composite system as a platform technique by adopting strategically designed poly (methyl methacrylate)-b-(dimethyl aminoethyl methacrylate) (PMD) as polymer compatibilizer to improve the water absorption resistance and mechanical properties derived from good interfacial adhesion and high cross-linking density of epoxy/silica composites were investigated. The as-prepared dual-networked epoxy composite system demonstrates a high-water absorption suppression of about 166.78% and a high tensile modulus of 4.6 GPa, compared to other epoxy composites. In addition, the current strategy has excellent expandability to various fillers also applicable to diverse epoxy composite systems.

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A strategy for dual-networked epoxy composite systems toward high cross-linking density and solid interfacial adhesion

Abstract

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