Abstract
Amorphous InGaZnO (a-IGZO) thin film transistors (TFTs) with double-layer gate dielectric were fabricated at low temperature and characterized. A stacked 150 nm-thick SiO 2/50 nm-thick HfO 2 dielectric layer was employed to improve the capacitance and leakage characteristics of the gate oxide. The SiO 2/HfO 2 showed a higher capacitance of 35 nF/cm 2 and a lower leakage current density of 4.6 nA/cm 2 than 200 nm-thick SiO 2. The obtained saturation mobility (μ sat), threshold voltage (V th), and subthreshold swing (S) of the fabricated TFTs were 18.8 cm 2 V -1 s -1, 0.88 V, and 0.48 V/decade, respectively. Furthermore, it was found that oxygen pressure during the IGZO channel layer deposition had a great influence on the performance of the TFTs.
Original language | English |
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Pages (from-to) | 2923-2926 |
Number of pages | 4 |
Journal | Materials Research Bulletin |
Volume | 47 |
Issue number | 10 |
DOIs | |
Publication status | Published - 2012 Oct |
Bibliographical note
Funding Information:This work was supported by Korea University Grant.
Keywords
- A. Amorphous materials
- B. Laser deposition
- D. Dielectric properties
- D. Electrical properties
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering