Amorphous InGaZnO thin film transistors with SiO 2/HfO 2 double-layer gate dielectric fabricated at low temperature

  • Ji Hong Kim
  • , Jae Won Kim
  • , Ji Hyung Roh
  • , Kyung Ju Lee
  • , Kang Min Do
  • , Ju Hong Shin
  • , Sang Mo Koo
  • , Byung Moo Moon*
  • *Corresponding author for this work

    Research output: Contribution to journalArticlepeer-review

    10 Citations (Scopus)

    Abstract

    Amorphous InGaZnO (a-IGZO) thin film transistors (TFTs) with double-layer gate dielectric were fabricated at low temperature and characterized. A stacked 150 nm-thick SiO 2/50 nm-thick HfO 2 dielectric layer was employed to improve the capacitance and leakage characteristics of the gate oxide. The SiO 2/HfO 2 showed a higher capacitance of 35 nF/cm 2 and a lower leakage current density of 4.6 nA/cm 2 than 200 nm-thick SiO 2. The obtained saturation mobility (μ sat), threshold voltage (V th), and subthreshold swing (S) of the fabricated TFTs were 18.8 cm 2 V -1 s -1, 0.88 V, and 0.48 V/decade, respectively. Furthermore, it was found that oxygen pressure during the IGZO channel layer deposition had a great influence on the performance of the TFTs.

    Original languageEnglish
    Pages (from-to)2923-2926
    Number of pages4
    JournalMaterials Research Bulletin
    Volume47
    Issue number10
    DOIs
    Publication statusPublished - 2012 Oct

    Bibliographical note

    Funding Information:
    This work was supported by Korea University Grant.

    Keywords

    • A. Amorphous materials
    • B. Laser deposition
    • D. Dielectric properties
    • D. Electrical properties

    ASJC Scopus subject areas

    • General Materials Science
    • Condensed Matter Physics
    • Mechanics of Materials
    • Mechanical Engineering

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