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An efficient off-chip impedance matching technique of L-band silicon integrated circuits
K. H. Kim
, S. W. Hwang
, S. W. Kim
, J. W. Park
, H. J. Chung
, S. H. Yoon
Research output
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Contribution to journal
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Article
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peer-review
1
Citation (Scopus)
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Engineering
Simulation Result
100%
Experimental Result
100%
Scattering Parameters
100%
Bonding Wire
100%
Time Domain
100%
Matching Network
100%
SPICE
100%
Lead Frame
100%
Bonding Pad
100%
L-Band
100%
Reflectance
100%
Integrated Circuit
100%
Keyphrases
Silicon Integrated Circuits
100%
L-band
100%
Impedance Matching Technique
100%
Chip Impedance
100%
Impedance Matching
33%
Bonding Wire
33%
Matching Network
33%
Lead Frame
33%
S-parameter Measurement
33%
Bonding Pad
33%
SPICE Model
33%
Silicon IC
33%
Input Reflection Coefficient
33%
IF Signal
33%