TY - GEN
T1 - An experimental study of onset condition for electrohydrodynamic jetting
AU - Kim, Hyojun
AU - Song, Junyoung
AU - Jeong, Jaeik
AU - Chung, Jaewon
PY - 2010
Y1 - 2010
N2 - Electrohydrodynamic (EHD) printing has recently received considerable attention for its potential of high resolution printing. In typical EHD printing, at the constant flow rate condition, the electric field applied between the nozzle and the electrically conductive substrate induces cone jet, so that a droplet smaller than nozzle diameter can be ejected. However, for real application, fluid should be supplied to the nozzle by the constant pressure for multi-nozzle EHD. In this work, at the constant back pressure condition in the reservoir, EHD jetting phenomena were observed changing bias voltage. In addition, the onset voltage for EHD jetting was measured changing glass capillary nozzle diameter (outer diameter: 23, 42μm), hydrostatic back pressure head on the reservoir and the distance between the nozzle and the bottom electrode.
AB - Electrohydrodynamic (EHD) printing has recently received considerable attention for its potential of high resolution printing. In typical EHD printing, at the constant flow rate condition, the electric field applied between the nozzle and the electrically conductive substrate induces cone jet, so that a droplet smaller than nozzle diameter can be ejected. However, for real application, fluid should be supplied to the nozzle by the constant pressure for multi-nozzle EHD. In this work, at the constant back pressure condition in the reservoir, EHD jetting phenomena were observed changing bias voltage. In addition, the onset voltage for EHD jetting was measured changing glass capillary nozzle diameter (outer diameter: 23, 42μm), hydrostatic back pressure head on the reservoir and the distance between the nozzle and the bottom electrode.
UR - http://www.scopus.com/inward/record.url?scp=77953777760&partnerID=8YFLogxK
U2 - 10.1115/InterPACK2009-89387
DO - 10.1115/InterPACK2009-89387
M3 - Conference contribution
AN - SCOPUS:77953777760
SN - 9780791843598
T3 - Proceedings of the ASME InterPack Conference 2009, IPACK2009
SP - 183
EP - 186
BT - Proceedings of the ASME InterPack Conference 2009, IPACK2009
T2 - 2009 ASME InterPack Conference, IPACK2009
Y2 - 19 July 2009 through 23 July 2009
ER -