TY - GEN
T1 - An overview of integrated THz electronics for communication applications
AU - Rieh, Jae Sung
AU - Jeon, Sanggeun
AU - Kim, Moonil
PY - 2011
Y1 - 2011
N2 - This review paper presents an overview of recent advances in integrated THz electronics that can be applied to wireless communication applications. Various approaches for implementing THz systems are compared and the relative advantages of solid-state semiconductor-based approach as a candidate for integrated THz transceivers are discussed. A comparison between available semiconductor technologies is also presented. Possible options for transceiver architecture are described and a review on recently reported results of integrated THz transceivers is provided with focus on the key performance and the architecture employed.
AB - This review paper presents an overview of recent advances in integrated THz electronics that can be applied to wireless communication applications. Various approaches for implementing THz systems are compared and the relative advantages of solid-state semiconductor-based approach as a candidate for integrated THz transceivers are discussed. A comparison between available semiconductor technologies is also presented. Possible options for transceiver architecture are described and a review on recently reported results of integrated THz transceivers is provided with focus on the key performance and the architecture employed.
UR - http://www.scopus.com/inward/record.url?scp=80053642829&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=80053642829&partnerID=8YFLogxK
U2 - 10.1109/MWSCAS.2011.6026592
DO - 10.1109/MWSCAS.2011.6026592
M3 - Conference contribution
AN - SCOPUS:80053642829
SN - 9781612848570
T3 - Midwest Symposium on Circuits and Systems
BT - 54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011
T2 - 54th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2011
Y2 - 7 August 2011 through 10 August 2011
ER -