An RF MEMS Sensor Driver/Readout SoC with Resonant Frequency Shift and Closed-Loop Envelope Regulation for Microplastic Detection

Seung Beom Ku; Kwonhong Lee; Han Sol Lee; Kyeongho Eom; Minju Park; Jinhyoung Kim; Cheolung Cha; Hyung Min Lee

doi:10.1109/ESSCIRC59616.2023.10268805

An RF MEMS Sensor Driver/Readout SoC with Resonant Frequency Shift and Closed-Loop Envelope Regulation for Microplastic Detection

Seung Beom Ku, Kwonhong Lee, Han Sol Lee, Kyeongho Eom, Minju Park, Jinhyoung Kim, Cheolung Cha, Hyung Min Lee

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

This paper presents a high-precision RF MEMS sensor driver and readout SoC to implement a low-cost portable device for microplastic (MP) detection. The proposed sensor driver and readout SoC operate as a miniaturized RF signal generator and network analyzer, respectively, that can analyze the resonant frequency shift depending on MP concentration. The system also adopts the closed-loop power amplifier (PA) envelope regulation to ensure consistent sensor driving against frequency shift. The 180-nm CMOS sensor driver chip exhibits an output power up to 0.23 dBm at 1.14 GHz and achieves small output power variation of4.9% between 1.1 GHz and 1.15 GHz, compared to 12.6% of the conventional drivers, thanks to PA envelope regulation. The 250-nm CMOS readout SoC can sense a minimum -10dBm input power and detect the changes of the input power with the dynamic range of18 dB, achieving a small linearity error of 1%.

Original language	English
Title of host publication	ESSCIRC 2023 - IEEE 49th European Solid State Circuits Conference
Publisher	IEEE Computer Society
Pages	481-484
Number of pages	4
ISBN (Electronic)	9798350304206
DOIs	https://doi.org/10.1109/ESSCIRC59616.2023.10268805
Publication status	Published - 2023
Event	49th IEEE European Solid State Circuits Conference, ESSCIRC 2023 - Lisbon, Portugal Duration: 2023 Sept 11 → 2023 Sept 14

Publication series

Name	European Solid-State Circuits Conference
Volume	2023-September
ISSN (Print)	1930-8833

Conference

Conference	49th IEEE European Solid State Circuits Conference, ESSCIRC 2023
Country/Territory	Portugal
City	Lisbon
Period	23/9/11 → 23/9/14

Bibliographical note

Publisher Copyright:
© 2023 IEEE.

Keywords

closed-loop envelope regulation
dynamic range
linearity error
Microplastic
output power variation
readout SoC
RF MEMS sensor
sensor driver

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/ESSCIRC59616.2023.10268805

Cite this

Ku, S. B., Lee, K., Lee, H. S., Eom, K., Park, M., Kim, J., Cha, C., & Lee, H. M. (2023). An RF MEMS Sensor Driver/Readout SoC with Resonant Frequency Shift and Closed-Loop Envelope Regulation for Microplastic Detection. In ESSCIRC 2023 - IEEE 49th European Solid State Circuits Conference (pp. 481-484). (European Solid-State Circuits Conference; Vol. 2023-September). IEEE Computer Society. https://doi.org/10.1109/ESSCIRC59616.2023.10268805

An RF MEMS Sensor Driver/Readout SoC with Resonant Frequency Shift and Closed-Loop Envelope Regulation for Microplastic Detection. / Ku, Seung Beom; Lee, Kwonhong; Lee, Han Sol et al.
ESSCIRC 2023 - IEEE 49th European Solid State Circuits Conference. IEEE Computer Society, 2023. p. 481-484 (European Solid-State Circuits Conference; Vol. 2023-September).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ku, SB, Lee, K, Lee, HS, Eom, K, Park, M, Kim, J, Cha, C & Lee, HM 2023, An RF MEMS Sensor Driver/Readout SoC with Resonant Frequency Shift and Closed-Loop Envelope Regulation for Microplastic Detection. in ESSCIRC 2023 - IEEE 49th European Solid State Circuits Conference. European Solid-State Circuits Conference, vol. 2023-September, IEEE Computer Society, pp. 481-484, 49th IEEE European Solid State Circuits Conference, ESSCIRC 2023, Lisbon, Portugal, 23/9/11. https://doi.org/10.1109/ESSCIRC59616.2023.10268805

Ku SB, Lee K, Lee HS, Eom K, Park M, Kim J et al. An RF MEMS Sensor Driver/Readout SoC with Resonant Frequency Shift and Closed-Loop Envelope Regulation for Microplastic Detection. In ESSCIRC 2023 - IEEE 49th European Solid State Circuits Conference. IEEE Computer Society. 2023. p. 481-484. (European Solid-State Circuits Conference). doi: 10.1109/ESSCIRC59616.2023.10268805

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title = "An RF MEMS Sensor Driver/Readout SoC with Resonant Frequency Shift and Closed-Loop Envelope Regulation for Microplastic Detection",

abstract = "This paper presents a high-precision RF MEMS sensor driver and readout SoC to implement a low-cost portable device for microplastic (MP) detection. The proposed sensor driver and readout SoC operate as a miniaturized RF signal generator and network analyzer, respectively, that can analyze the resonant frequency shift depending on MP concentration. The system also adopts the closed-loop power amplifier (PA) envelope regulation to ensure consistent sensor driving against frequency shift. The 180-nm CMOS sensor driver chip exhibits an output power up to 0.23 dBm at 1.14 GHz and achieves small output power variation of4.9% between 1.1 GHz and 1.15 GHz, compared to 12.6% of the conventional drivers, thanks to PA envelope regulation. The 250-nm CMOS readout SoC can sense a minimum -10dBm input power and detect the changes of the input power with the dynamic range of18 dB, achieving a small linearity error of 1%.",

keywords = "closed-loop envelope regulation, dynamic range, linearity error, Microplastic, output power variation, readout SoC, RF MEMS sensor, sensor driver",

author = "Ku, {Seung Beom} and Kwonhong Lee and Lee, {Han Sol} and Kyeongho Eom and Minju Park and Jinhyoung Kim and Cheolung Cha and Lee, {Hyung Min}",

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AB - This paper presents a high-precision RF MEMS sensor driver and readout SoC to implement a low-cost portable device for microplastic (MP) detection. The proposed sensor driver and readout SoC operate as a miniaturized RF signal generator and network analyzer, respectively, that can analyze the resonant frequency shift depending on MP concentration. The system also adopts the closed-loop power amplifier (PA) envelope regulation to ensure consistent sensor driving against frequency shift. The 180-nm CMOS sensor driver chip exhibits an output power up to 0.23 dBm at 1.14 GHz and achieves small output power variation of4.9% between 1.1 GHz and 1.15 GHz, compared to 12.6% of the conventional drivers, thanks to PA envelope regulation. The 250-nm CMOS readout SoC can sense a minimum -10dBm input power and detect the changes of the input power with the dynamic range of18 dB, achieving a small linearity error of 1%.

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KW - output power variation

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An RF MEMS Sensor Driver/Readout SoC with Resonant Frequency Shift and Closed-Loop Envelope Regulation for Microplastic Detection

Abstract

Publication series

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Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

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Cite this