Abstract
Photo diode (PD) well potential of 4-Tr CMOS image sensor (CIS) is changed according to the axial direction of off-axis wafer slicing which minimizes the channeling effect of ion implantation process. Channeling causes an incomplete charge transfer in the PD, and then results in the loss of PD well capacity eventually. In this paper, the effect of the axial direction of wafer slicing on the PD well potential profile is simulated with TCAD tool and the simulation result is examined through CMOS process actually. Furthermore, we show a way to compensate the change of effective tilt angle during the ion implantation process for creating N-type region in PD.
Original language | English |
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Title of host publication | Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014 |
Editors | Jia Zhou, Ting-Ao Tang |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9781479932962 |
DOIs | |
Publication status | Published - 2014 Jan 23 |
Event | 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014 - Guilin, China Duration: 2014 Oct 28 → 2014 Oct 31 |
Publication series
Name | Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014 |
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Other
Other | 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014 |
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Country/Territory | China |
City | Guilin |
Period | 14/10/28 → 14/10/31 |
Bibliographical note
Publisher Copyright:© 2014 IEEE.
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering
- Computer Science Applications