Architecting large-scale SRAM arrays with monolithic 3D integration

Joonho Kong, Young Ho Gong, Sung Woo Chung

Research output: Chapter in Book/Report/Conference proceedingConference contribution

17 Citations (Scopus)

Abstract

In this paper, we architect large-scale SRAM arrays with monolithic 3D (M3D) integration technology. We introduce M3D-based SRAM arrays with three different ways of integration: M3D-R (vertical routing-only), M3D-VBL (vertical bitline), and M3D-VWL (vertical wordline). We also apply M3D-based SRAM arrays to last-level caches: Tag arrays for eDRAM LLCs and data arrays for SRAM LLCs. The proposed LLCs with M3D-based SRAM arrays lead to better performance and lower energy by 0.02%∼1.7% and 49.1%∼79.1%, respectively, compared to that with TSV-based 3D SRAM arrays.

Original languageEnglish
Title of host publicationISLPED 2017 - IEEE/ACM International Symposium on Low Power Electronics and Design
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509060238
DOIs
Publication statusPublished - 2017 Aug 11
Event22nd IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2017 - Taipei, Taiwan, Province of China
Duration: 2017 Jul 242017 Jul 26

Publication series

NameProceedings of the International Symposium on Low Power Electronics and Design
ISSN (Print)1533-4678

Other

Other22nd IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2017
Country/TerritoryTaiwan, Province of China
CityTaipei
Period17/7/2417/7/26

Bibliographical note

Funding Information:
ACKNOWLEDGMENT This research was supported by NanoMaterial Technology Development Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT and Future Planning (No. 2015M3A7B7045470 and No. 2016M3A7B4910430). This research was also supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT & Future Planning (2015R1C1A1A01051836). We would also like to thank Prof. Sung Kyu Lim for discussion on M3D parameters and anonymous reviewers for their helpful feedback.

Publisher Copyright:
© 2017 IEEE.

Keywords

  • Energy
  • Last-Level Caches
  • Monolithic 3D Integrations
  • Performance

ASJC Scopus subject areas

  • General Engineering

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