Bending Sensor Based on Controlled Microcracking Regions for Application toward Wearable Electronics and Robotics

Do Hoon Lee, Jun Chang Yang, Joo Yong Sim, Heemin Kang, Hyung Ryong Kim, Steve Park

Research output: Contribution to journalArticlepeer-review

12 Citations (Scopus)


A soft bending sensor based on the inverse pyramid structure is demonstrated, revealing that it can effectively suppress microcrack formation in designated regions, thus allowing the cracks to open gradually with bending in a controlled manner. Such a feature enabled the bending sensor to simultaneously have a wide dynamic range of bending strain (0.025-5.4%), high gauge factor (∼74), and high linearity (R2∼0.99). Furthermore, the bending sensor can capture repeated instantaneous changes in strain and various types of vibrations, owing to its fast response time. Moreover, the bending direction can be differentiated with a single layer of the sensor, and using an array of sensors integrated on a glove, object recognition was demonstrated via machine learning. Finally, a self-monitoring proprioceptive ionic electroactive polymer (IEAP) actuator capable of operating in liquid was demonstrated. Such features of our bending sensor will enable a simple and effective way of detecting sophisticated motion, thus potentially advancing wearable healthcare monitoring electronics and enabling proprioceptive soft robotics.

Original languageEnglish
Pages (from-to)31312-31320
Number of pages9
JournalACS Applied Materials and Interfaces
Issue number27
Publication statusPublished - 2022 Jul 13

Bibliographical note

Funding Information:
This work was supported by the Bio & Medical Technology Development Program (NRF-2017M3A9E4047243) and the KAIST UP Program.

Publisher Copyright:
© 2022 American Chemical Society. All rights reserved.


  • bending sensor
  • healthcare monitoring
  • inverse pyramid
  • soft robotics
  • tactile object recognition

ASJC Scopus subject areas

  • General Materials Science


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