Abstract
As cooling requirements for electronic devices, e.g. computer processor units, power modules, etc. increase beyond the capabilities of air-cooling, interest has moved to several alternatives such as thermoelectric coolers, impinging jets and heat exchangers with phase change. Included among these, the capillary pumped loop is a very competitive cooling device, because of its performance reliability, no power requirements and low manufacturing cost. In this paper, a heat spreader employing capillary pumped loop principles was made of aluminum and copper and tested. The copper CPL heat spreader with heat sinks and fans on the condenser (86mm thick, 60mm wide, 181mm long) has demonstrated a cooling capacity of 640W at atmospheric pressure in the vertical orientation and maintains a difference between TIHE (temperature of the interface between heater and evaporator) and TAME (ambient temperature) lower than 100°C.
| Original language | English |
|---|---|
| Pages (from-to) | 283-290 |
| Number of pages | 8 |
| Journal | American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD |
| Volume | 369 |
| Issue number | 7 |
| Publication status | Published - 2001 |
| Externally published | Yes |
| Event | 2001 ASME International Mechanical Engineering Congress and Exposition - New York, NY, United States Duration: 2001 Nov 11 → 2001 Nov 16 |
Keywords
- Capillary pumped loop
- CPU
- Heat spreader
- IGBT
- Phase change
- Porous sheet
- Thermal management
ASJC Scopus subject areas
- Mechanical Engineering
- Fluid Flow and Transfer Processes