High power light-emitting diodes (LEDs) lighting has drawn a great interest in the field of street light system in recent years. Key parameters for successful launching of LED street light in the commercial market are price and light efficiency, respectively, and they are greatly influenced by the materials and design factors used in high power LED package. This article presents a new design and materials processing technology to realize the solution of LED packaging with advantageous in price and performance. Cost effective materials and processing technology can be realized via thick film glass-ceramic insulating layer and silver conductor. Highly effective thermal design using direct heat dissipation to heat sink in LED package is demonstrated.
Bibliographical noteFunding Information:
Acknowledgements This work was supported by the R&D support program of the Small & Medium Business Administration (SMBA), Korea (Grant No. S1071285, 2010–2012).
- heat dissipation
- light-emitting diodes (LEDs) package
- thermal resistance
- thick film
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering