Abstract
In this letter, we demonstrate an n-indium-gallium-zinc-oxide (IGZO)/i-germanium (Ge) heterojunction diode with an ultrashallow junction depth of \sim 37 nm. X-ray diffraction, atomic force microscopy, and secondary ion mass spectrometry analyses are performed to precisely investigate the n-IGZO and n-IGZO/i-Ge junctions. When the junction diodes are annealed at between 400 \circC and 600 \circC, a very high on-current density (\hbox180-320\ \hboxA/cm2), which is comparable to that of a Ti/i-Ge reference junction, is obtained. In particular, after the 600 \circC anneal, a fairly high on/off-current ratio (\hbox7 \times \hbox102) is also observed.
Original language | English |
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Article number | 6296680 |
Pages (from-to) | 1363-1365 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 33 |
Issue number | 10 |
DOIs | |
Publication status | Published - 2012 |
Bibliographical note
Funding Information:Manuscript received July 9, 2012; accepted July 25, 2012. Date of publication September 6, 2012; date of current version September 21, 2012. This work was supported in part by the Basic Science Research Program through the National Research Foundation of Korea funded by the Ministry of Education, Science, and Technology under NRF-2012-0003218 and in part by the International Collaborative R&D Program of Korea Institute of Energy Technology Evaluation and Planning (KETEP) funded by the Ministry of Knowledge Economy of the Korean Government under Grant 2011-8520010030. The review of this letter was arranged by Editor O. Manasreh.
Keywords
- Germanium (Ge)
- heterojunction
- indium-gallium-zinc-oxide (IGZO)
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering