Abstract
Several types of buffer layer structures, including superlattice and step-graded layers, have been employed to reduce the threading dislocation in SiGe epitaxial layers. A new technique, using a 0.1 μm thick Si buffer grown at 450°C by molecular beam epitaxy, provides the best results. For a 0.5 μm thick Si0.85Ge0.15 layer, the dislocation density is ≤ 105 cm-2. Hall measurements indicate an improvement in the hole mobility of a 1 μm thick Boron doped Si0.7Ge0.3 layer. A SiGe/Si heterojunction bipolar transistor has been fabricated exploiting the low temperature Si buffer. Transmission electron microscopy of the structure does not indicate any evidence of threading dislocations.
Original language | English |
---|---|
Pages (from-to) | 499-503 |
Number of pages | 5 |
Journal | Journal of Crystal Growth |
Volume | 175-176 |
Issue number | PART 1 |
DOIs | |
Publication status | Published - 1997 May |
Externally published | Yes |
Keywords
- DLTS
- LT-Si buffer
- TEM
- Threading dislocation density
ASJC Scopus subject areas
- Condensed Matter Physics
- Inorganic Chemistry
- Materials Chemistry